AMD Xilinx
XC2VP20-7FFG1152I
XC2VP20-7FFG1152I ECAD Model
XC2VP20-7FFG1152I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 2320 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2320 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP20-7FFG1152I Datasheet Download
XC2VP20-7FFG1152I Overview
The XC2VP20-7FFG1152I chip model is a high-performance, low-power FPGA from Xilinx. It is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. The chip is programmed using the HDL language, and is capable of providing high performance and low power consumption.
The XC2VP20-7FFG1152I chip model is an ideal choice for applications that require high-performance computing. It is capable of processing large amounts of data quickly, making it suitable for use in applications such as digital signal processing, embedded processing, and image processing. Furthermore, it is well suited for use in networks and other intelligent scenarios, making it an ideal choice for the era of fully intelligent systems.
In terms of product design, the XC2VP20-7FFG1152I chip model has a wide range of features and capabilities. It is capable of providing high-performance computing and low power consumption, making it an ideal choice for a variety of applications. Furthermore, it is capable of providing a variety of interfaces, such as USB, Ethernet, and more, making it an ideal choice for a wide range of applications.
When designing a system using the XC2VP20-7FFG1152I chip model, it is important to consider the specific requirements of the system. It is important to consider the specific design requirements of the chip model, such as the power requirements, the number of pins, the type of memory, and more. Furthermore, it is important to consider the specific design requirements of the system, such as the number of processors, the size of the memory, and more.
To ensure the successful implementation of the XC2VP20-7FFG1152I chip model, it is important to consider a variety of factors. It is important to consider the specific design requirements of the chip model, as well as the specific design requirements of the system. Furthermore, it is important to consider actual case studies and precautions, such as the type of memory, the number of pins, and more. By considering all of these factors, it is possible to ensure the successful implementation of the XC2VP20-7FFG1152I chip model in a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||