XC2VP20-6FGG676C

The XC2VP20-6FGG676C is a field programmable gate array (FPGA) chip manufactured by Xilinx. It is a mid-range device, suitable for applications such as embedded systems, communications, and industrial control. The chip has a Virtex II Pro architecture, and is implemented in a 676-pin plastic ball grid array (PBGA) package.

The chip has a capacity of 20 million system gates and up to 6.6 million system gates of embedded RAM. It has a total of 676 I/O pins, with 474 user I/O pins, and 202 dedicated I/O pins. The user I/O pins are configurable as LVTTL, LVCMOS, SSTL, HSTL, and GTL. It also has four 3.3V PCI-X compliant ports, with support for up to four 32-bit PCI-X transactions.

The chip has a clock frequency of up to 200 MHz, with a maximum operating temperature of 85 degrees Celsius. It has a power consumption of 9.5W at full load, and is RoHS compliant. It also features advanced power management features, such as dynamic power management and adaptive clocking.

The XC2VP20-6FGG676C is suitable for a wide range of applications, including communications, embedded systems, industrial control, and networking. It is designed to provide high performance, low power consumption, and reliable operation in challenging environments.