XC2VP2-7FFG672C
XC2VP2-7FFG672C
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rohs

AMD Xilinx

XC2VP2-7FFG672C


XC2VP2-7FFG672C
F20-XC2VP2-7FFG672C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

XC2VP2-7FFG672C ECAD Model


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XC2VP2-7FFG672C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 204
Number of Outputs 204
Number of Logic Cells 3168
Number of CLBs 352
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 352 CLBS
Clock Frequency-Max 1.35 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.65 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA672,26X26,40
Pin Count 672
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XC2VP2-7FFG672C Datasheet Download


XC2VP2-7FFG672C Overview



The chip model XC2VP2-7FFG672C is a highly advanced and sophisticated microchip that has been developed for use in a wide range of industries. It is capable of handling complex tasks and processes quickly and efficiently, making it an ideal choice for a variety of applications. The chip model offers a range of advantages that make it an attractive choice for those looking to upgrade their technology.


The chip model XC2VP2-7FFG672C is designed to be highly reliable, with a long life cycle and minimal downtime. It is also capable of handling large amounts of data, making it ideal for use in networks and other data-intensive environments. This makes it an ideal choice for those looking to upgrade their technology and stay ahead of the competition.


The chip model XC2VP2-7FFG672C is also designed to be energy efficient, with low power consumption and minimal heat output. This makes it an ideal choice for those looking to reduce their energy costs and improve their overall efficiency.


In terms of future applications, the chip model XC2VP2-7FFG672C is expected to be used in a variety of different intelligent scenarios. It is likely to be used in the development of networks that are capable of handling large amounts of data quickly and efficiently. It is also likely to be used in the development of intelligent robots and other automated systems.


In order to use the chip model XC2VP2-7FFG672C effectively, it is important to have a good understanding of the technology and how it works. Those who are looking to use the chip model should have a good understanding of the different components, as well as the programming language used to control it. It is also important to have a good understanding of the different types of sensors and other devices that can be used in conjunction with the chip model.


Overall, the chip model XC2VP2-7FFG672C is an advanced and sophisticated microchip that is expected to be used in a variety of different scenarios in the future. It is capable of handling large amounts of data quickly and efficiently, making it an ideal choice for those looking to upgrade their technology. It is also energy efficient, making it an attractive choice for those looking to reduce their energy costs and improve their overall efficiency. Those who are looking to use the chip model effectively should have a good understanding of the technology and how it works, as well as the programming language used to control it.



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