
AMD Xilinx
XC2VP2-7FF672C
XC2VP2-7FF672C ECAD Model
XC2VP2-7FF672C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 204 | |
Number of Outputs | 204 | |
Number of Logic Cells | 3168 | |
Number of CLBs | 352 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 352 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.65 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA672,26X26,40 | |
Pin Count | 672 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC2VP2-7FF672C Datasheet Download
XC2VP2-7FF672C Overview
The Xilinx XC2VP2-7FF672C is a versatile and powerful chip model that offers a wide range of features and capabilities. It is designed to meet the needs of a variety of modern applications, from high-end communications systems to advanced robotics.
The XC2VP2-7FF672C is an FPGA-based chip model that is based on the Virtex-II Pro platform. It features a total of 672Kbits of embedded memory and a wide range of I/O ports. This makes it suitable for a variety of applications, including high-speed data transfer, high-speed signal processing, and high-performance computing.
The XC2VP2-7FF672C is designed to be highly configurable and flexible. It can be easily upgraded to meet changing application requirements. The chip model is also designed to be compatible with a wide range of development tools and software, making it easy to use for both experienced and novice designers.
The XC2VP2-7FF672C can be used to develop and popularize future intelligent robots. It is capable of providing the necessary hardware and software support for the development of advanced robotic systems. It is also capable of providing the necessary support for the development of advanced communication systems.
In order to effectively use the XC2VP2-7FF672C, certain technical talents are needed. The chip model requires a good understanding of hardware and software design, as well as an understanding of the underlying architecture. Additionally, it is important to have a good understanding of the development tools and software that are compatible with the chip model.
Case studies of the XC2VP2-7FF672C can provide valuable insight into the chip model and its capabilities. These case studies can also provide valuable information on how to effectively use the chip model and how to avoid common mistakes. Additionally, it is important to take certain precautions when using the chip model. These precautions include making sure that the chip model is connected to the correct power source and that the correct software is installed.
In conclusion, the Xilinx XC2VP2-7FF672C is a powerful and versatile chip model that is capable of meeting a variety of modern application requirements. It is designed to be highly configurable and flexible, making it suitable for a variety of uses. It can also be used to develop and popularize future intelligent robots, provided the right technical talents and precautions are taken.
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