AMD Xilinx
XC2VP2-5FFG672I
XC2VP2-5FFG672I ECAD Model
XC2VP2-5FFG672I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 204 | |
| Number of Outputs | 204 | |
| Number of Logic Cells | 3168 | |
| Number of CLBs | 352 | |
| Combinatorial Delay of a CLB-Max | 360 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 352 CLBS | |
| Clock Frequency-Max | 1.05 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA672,26X26,40 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2VP2-5FFG672I Datasheet Download
XC2VP2-5FFG672I Overview
The Xilinx XC2VP2-5FFG672I chip model is a highly advanced, cutting-edge technology that offers a variety of advantages for its users. It is a Field Programmable Gate Array (FPGA) chip model with a Virtex-II Pro platform, and it is designed to provide high-performance and low-power solutions for a wide range of applications. This chip model is designed to provide a high level of flexibility and scalability, allowing users to quickly and easily configure the chip to meet their specific needs.
The XC2VP2-5FFG672I chip model offers a number of advantages, including a high speed, low latency, and low power consumption. It also offers an integrated memory controller, allowing users to easily access and store data. Additionally, the chip model includes a range of features, such as a high-performance floating-point unit and a wide range of analog and digital I/O interfaces. These features make the XC2VP2-5FFG672I chip model an ideal choice for a wide range of applications, including embedded systems, communications systems, and networking systems.
The XC2VP2-5FFG672I chip model is designed to meet the needs of a wide range of industries, including automotive, aerospace, telecommunications, and medical. As the demand for high-performance, low-power solutions continues to grow, the XC2VP2-5FFG672I chip model is expected to become increasingly popular in these industries. Additionally, the chip model is designed to be easily upgradable, allowing users to take advantage of the latest technology and features as they become available.
The XC2VP2-5FFG672I chip model is also designed to be used in a variety of networks, including wireless networks, optical networks, and wide area networks. Additionally, the chip model is also capable of being used in intelligent scenarios, such as machine learning, natural language processing, and image processing. This makes the XC2VP2-5FFG672I chip model a great choice for applications that require high-performance, low-power solutions.
The XC2VP2-5FFG672I chip model is an excellent choice for a wide range of applications, and its features and capabilities make it a great choice for the future. As the demand for high-performance, low-power solutions continues to grow, the XC2VP2-5FFG672I chip model is expected to become increasingly popular in a variety of industries. Additionally, the chip model is designed to be easily upgradable, allowing users to take advantage of the latest technology and features as they become available. It is also designed to be used in a variety of networks, including wireless networks, optical networks, and wide area networks. Additionally, the chip model is also capable of being used in intelligent scenarios, such as machine learning, natural language processing, and image processing. This makes the XC2VP2-5FFG672I chip model an ideal choice for the future, as it is capable of providing high-performance, low-power solutions for a wide range of applications, even in the era of fully intelligent systems.
You May Also Be Interested In
1,781 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $105.6480 | $105.6480 |
| 10+ | $104.5120 | $1,045.1200 |
| 100+ | $98.8320 | $9,883.2000 |
| 1000+ | $93.1520 | $46,576.0000 |
| 10000+ | $85.2000 | $85,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||