AMD Xilinx
XC2VP100-7FFG1704I
XC2VP100-7FFG1704I ECAD Model
XC2VP100-7FFG1704I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 11024 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11024 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1704 | |
| Pin Count | 1704 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP100-7FFG1704I Datasheet Download
XC2VP100-7FFG1704I Overview
The XC2VP100-7FFG1704I chip model is a powerful solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It is programmed in a Hardware Description Language (HDL) and is designed to be compatible with a wide range of industry-standard development tools. Its high-speed performance, small size, and low power consumption make it an ideal choice for many applications.
The future of the XC2VP100-7FFG1704I chip model is closely linked to the development of new technologies and the growth of the industries which use it. As the demand for faster and more efficient digital signal processing increases, the XC2VP100-7FFG1704I chip model will be at the forefront of the industry. It is likely that new technologies, such as artificial intelligence and machine learning, will be integrated into the XC2VP100-7FFG1704I chip model in order to keep up with the demands of a rapidly changing world.
The XC2VP100-7FFG1704I chip model is well-suited for use in a variety of networked and intelligent scenarios. It has the potential to be used in fully intelligent systems, such as self-driving cars and smart homes. As technology advances, the XC2VP100-7FFG1704I chip model can be used to create more efficient, secure, and reliable networks and systems.
The XC2VP100-7FFG1704I chip model is a powerful, reliable, and cost-effective solution for many applications. It is designed to be compatible with a wide range of industry-standard development tools and can be used in a variety of networked and intelligent scenarios. As technology advances, the XC2VP100-7FFG1704I chip model will be at the forefront of the industry and will be used to create more efficient, secure, and reliable networks and systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||