
AMD Xilinx
XC2VP100-7FF1704I
XC2VP100-7FF1704I ECAD Model
XC2VP100-7FF1704I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 1040 | |
Number of Outputs | 1040 | |
Number of Logic Cells | 99216 | |
Number of CLBs | 11024 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 11024 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1704,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1704 | |
Pin Count | 1704 |
XC2VP100-7FF1704I Datasheet Download
XC2VP100-7FF1704I Overview
The XC2VP100-7FF1704I is a powerful and versatile chip model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. Its features and design make it a great choice for a variety of applications.
The XC2VP100-7FF1704I is designed to be programmed using a Hardware Description Language (HDL) like Verilog or VHDL. This allows for efficient and reliable coding of the chip's features and functions. The chip model also supports the use of various peripherals, such as Ethernet, USB, and UART.
In terms of industry trends, the XC2VP100-7FF1704I is a great choice for applications that require high performance and reliability. It is well suited for use in consumer electronics, automotive, industrial, and medical applications. As technology advances, the chip model will continue to be a viable option for many different applications.
The product description and design requirements of the XC2VP100-7FF1704I are detailed in the product datasheet. This document outlines the features of the chip model and provides information on its performance and power consumption. It also contains diagrams and diagrams to help with the design process.
When designing an application using the XC2VP100-7FF1704I, it is important to consider the specific technologies that are required for the application. It is also important to consider the power consumption, heat dissipation, and other factors that may affect the performance of the chip.
In terms of actual case studies, there are many examples of successful applications using the XC2VP100-7FF1704I. These case studies can provide valuable insight into the design process and provide useful tips and tricks for designing applications with the chip model.
Overall, the XC2VP100-7FF1704I is a powerful and versatile chip model that is well suited for a variety of applications. Its features, design, and performance make it a great choice for many different applications. When designing an application with this chip model, it is important to consider the specific technologies that are required and to take into account the power consumption, heat dissipation, and other factors that may affect the performance of the chip. With the right design and application, the XC2VP100-7FF1704I can be a great choice for many different applications.
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