XC2V8000-4FFG1152I
XC2V8000-4FFG1152I
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AMD Xilinx

XC2V8000-4FFG1152I


XC2V8000-4FFG1152I
F20-XC2V8000-4FFG1152I
Active
IC FPGA 824 I/O 1152FCBGA
1152-FCBGA (35x35)

XC2V8000-4FFG1152I ECAD Model


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XC2V8000-4FFG1152I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 11648
Total RAM Bits 3096576
Number of I/O 824
Number of Gates 8000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number XC2V8000

XC2V8000-4FFG1152I Datasheet Download


XC2V8000-4FFG1152I Overview



The XC2V8000-4FFG1152I is a high-performance, low-cost field programmable gate array (FPGA) manufactured by Xilinx. It is based on the Virtex-II Pro platform and provides up to 8 million system gates with up to 152 I/O pins. The chip is designed for high-speed, high-density applications in a variety of fields, including communications, networking, video, image processing, and industrial automation.


The XC2V8000-4FFG1152I features an advanced architecture with high-speed, low-skew clock distribution and multiple clock domains. It also supports various high-speed I/O standards, including LVDS, LVPECL, and SSTL2. It also has an integrated memory controller for DDR/DDR2/DDR3/DDR4/LPDDR2/LPDDR3/LPDDR4/QDR/RLDRAM/RLDRAM2/RLDRAM3 memory interfaces. The chip also supports a variety of digital signal processing (DSP) functions, including FFT, FIR, and CORDIC.


The XC2V8000-4FFG1152I is suitable for a wide range of applications, including high-speed networking, communications, video and image processing, industrial automation, and embedded systems. It is ideal for applications that require high-speed, low-power, and cost-effective solutions. It is also suitable for applications that require high-density, high-performance, and low-cost solutions.



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