AMD Xilinx
XC2V6000-5BFG957I
XC2V6000-5BFG957I ECAD Model
XC2V6000-5BFG957I Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Virtex®-II | |
| Package | Tray | |
| Number of LABs/CLBs | 8448 | |
| Total RAM Bits | 2654208 | |
| Number of I/O | 684 | |
| Number of Gates | 6000000 | |
| Voltage - Supply | 1.425V ~ 1.575V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Package / Case | 957-BBGA, FCBGA | |
| Supplier Device Package | 957-FCBGA (40x40) | |
| Base Product Number | XC2V6000 |
XC2V6000-5BFG957I Datasheet Download
XC2V6000-5BFG957I Overview
The XC2V6000-5BFG957I chip is a Field Programmable Gate Array (FPGA) manufactured by Xilinx, Inc. It is a 5 volt device with an operating temperature range of 0 to 85°C. It has a capacity of 120,000 system gates, and is suitable for high-performance applications.
The XC2V6000-5BFG957I chip has a total of 957 user I/O pins, with 4 clocks, 2 global clocks and 2 dedicated clocks. It also has 2,048 18Kbit block RAMs, and a total of 1,536 18Kbit distributed RAMs. It includes a 32-bit multiplier and a 32-bit accumulator, and supports digital signal processing (DSP) applications.
The XC2V6000-5BFG957I chip is suitable for use in a wide range of applications, such as communications, networking, embedded systems, automotive, industrial, medical, and aerospace. It is also suitable for applications requiring high-speed data transfer, high-speed signal processing, and high-density logic.
The XC2V6000-5BFG957I chip is designed to be low-power, and is compliant with the RoHS Directive. It is also compatible with the Xilinx ISE design suite, and supports both Verilog and VHDL coding languages. It is also supported by a range of third-party development tools.
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