XC2V6000-4FFG1517I
XC2V6000-4FFG1517I
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rohs

AMD Xilinx

XC2V6000-4FFG1517I


XC2V6000-4FFG1517I
F20-XC2V6000-4FFG1517I
Active
IC FPGA 1104 I/O 1517FCBGA
1517-FCBGA (40x40)

XC2V6000-4FFG1517I ECAD Model


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XC2V6000-4FFG1517I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 8448
Total RAM Bits 2654208
Number of I/O 1104
Number of Gates 6000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Base Product Number XC2V6000

XC2V6000-4FFG1517I Datasheet Download


XC2V6000-4FFG1517I Overview



The XC2V6000-4FFG1517I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx Inc. It is based on the Virtex-II Pro architecture and comes in a 1517-pin Flip-Chip Ball Grid Array (FCBGA) package. It features a maximum operating frequency of 250 MHz and has a total of 6,000 logic cells. The device also includes 4,096 bits of distributed RAM and a total of 4,096 I/O pins. It is capable of providing up to 8 user-defined I/O standards and supports both 3.3V and 1.8V logic levels.


The XC2V6000-4FFG1517I is designed for high-performance, high-density applications. It is suitable for applications such as digital signal processing, embedded processor systems, high-speed networking and communication, and video processing. The device also supports the Xilinx Platform Studio and Xilinx System Generator for DSP tools, which allow users to quickly develop and deploy system-level designs. Additionally, the chip is designed to be low power and is RoHS compliant.


Overall, the XC2V6000-4FFG1517I is a high-performance FPGA chip that is suitable for a wide range of applications. It offers a wide range of features and capabilities that make it an ideal choice for designers who need a reliable and powerful device.



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