XC2V6000-4FFG1152I
XC2V6000-4FFG1152I
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AMD Xilinx

XC2V6000-4FFG1152I


XC2V6000-4FFG1152I
F20-XC2V6000-4FFG1152I
Active
IC FPGA 824 I/O 1152FCBGA
1152-FCBGA (35x35)

XC2V6000-4FFG1152I ECAD Model


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XC2V6000-4FFG1152I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 8448
Total RAM Bits 2654208
Number of I/O 824
Number of Gates 6000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number XC2V6000

XC2V6000-4FFG1152I Datasheet Download


XC2V6000-4FFG1152I Overview



The XC2V6000-4FFG1152I is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a medium-density device, providing a maximum of 6 million system gates and up to 152 I/O pins. It is a member of the Virtex-II Pro family, which is designed to provide high-performance, high-density solutions for applications such as high-speed networking, embedded processors, digital signal processing and video applications.


The XC2V6000-4FFG1152I is a 4-layer device, with two 4-input look-up tables (LUTs) per logic cell, and up to 13,000 Flip-Flops. It has a maximum clock frequency of 250MHz, and supports up to 8 Multi-Gigabit Transceivers (MGTs). It has a total of 11,520 logic cells, and can support up to 152 I/O pins. It has a maximum power dissipation of 8.6W, and a maximum operating temperature of 85 degrees Celsius.


The XC2V6000-4FFG1152I is suitable for a variety of applications, including high-speed networking, embedded processors, digital signal processing and video applications. It can be used to implement a wide range of functions, from high-performance logic and control functions, to high-speed networking, to high-speed memory interfaces. It is also suitable for a variety of other applications, such as industrial automation, medical imaging, automotive safety systems and consumer electronics.


The XC2V6000-4FFG1152I is a versatile FPGA device, providing a high-performance, high-density solution for a variety of applications. It is a cost-effective solution for applications requiring high-speed networking, embedded processors, digital signal processing and video applications.



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