
AMD Xilinx
XC2V6000-4FFG1152I
XC2V6000-4FFG1152I ECAD Model
XC2V6000-4FFG1152I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 8448 | |
Total RAM Bits | 2654208 | |
Number of I/O | 824 | |
Number of Gates | 6000000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1152-BBGA, FCBGA | |
Supplier Device Package | 1152-FCBGA (35x35) | |
Base Product Number | XC2V6000 |
XC2V6000-4FFG1152I Datasheet Download
XC2V6000-4FFG1152I Overview
The XC2V6000-4FFG1152I is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a medium-density device, providing a maximum of 6 million system gates and up to 152 I/O pins. It is a member of the Virtex-II Pro family, which is designed to provide high-performance, high-density solutions for applications such as high-speed networking, embedded processors, digital signal processing and video applications.
The XC2V6000-4FFG1152I is a 4-layer device, with two 4-input look-up tables (LUTs) per logic cell, and up to 13,000 Flip-Flops. It has a maximum clock frequency of 250MHz, and supports up to 8 Multi-Gigabit Transceivers (MGTs). It has a total of 11,520 logic cells, and can support up to 152 I/O pins. It has a maximum power dissipation of 8.6W, and a maximum operating temperature of 85 degrees Celsius.
The XC2V6000-4FFG1152I is suitable for a variety of applications, including high-speed networking, embedded processors, digital signal processing and video applications. It can be used to implement a wide range of functions, from high-performance logic and control functions, to high-speed networking, to high-speed memory interfaces. It is also suitable for a variety of other applications, such as industrial automation, medical imaging, automotive safety systems and consumer electronics.
The XC2V6000-4FFG1152I is a versatile FPGA device, providing a high-performance, high-density solution for a variety of applications. It is a cost-effective solution for applications requiring high-speed networking, embedded processors, digital signal processing and video applications.
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