XC2V6000-4FF1517I
XC2V6000-4FF1517I
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rohs

AMD Xilinx

XC2V6000-4FF1517I


XC2V6000-4FF1517I
F20-XC2V6000-4FF1517I
Active
IC FPGA 1104 I/O 1517FCBGA
1517-FCBGA (40x40)

XC2V6000-4FF1517I ECAD Model


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XC2V6000-4FF1517I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 8448
Total RAM Bits 2654208
Number of I/O 1104
Number of Gates 6000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Base Product Number XC2V6000

XC2V6000-4FF1517I Datasheet Download


XC2V6000-4FF1517I Overview



The XC2V6000-4FF1517I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is a high-performance, low-power, and low-cost FPGA chip that is suitable for a wide range of applications.


The XC2V6000-4FF1517I has a total of 4,096 logic cells, each consisting of four slices with 4 flip-flops and 15 product terms. It also has 1,517 slices and 4,096 flip-flops, which provide a total of 32,768 bits of memory. The chip has a total of 1,517 I/O pins, with a maximum I/O frequency of 200 MHz. It also has two PowerPC 405 processors with a maximum clock frequency of 200 MHz.


The XC2V6000-4FF1517I is ideal for high-performance embedded applications such as networking, storage, and multimedia. It can be used for applications such as video processing, image processing, digital signal processing, and other embedded applications.


The chip has a low power consumption of 4.5 W and a maximum operating temperature of 85°C. It is also RoHS compliant and supports a wide range of industry-standard tools and design flows.


Overall, the XC2V6000-4FF1517I is a powerful and cost-effective FPGA chip that is suitable for a wide range of embedded applications. It has a high performance, low power consumption, and a wide range of features that make it an ideal choice for designers looking for a reliable and efficient FPGA solution.



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