AMD Xilinx
XC2V6000-4FF1152C
XC2V6000-4FF1152C ECAD Model
XC2V6000-4FF1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2V6000-4FF1152C Datasheet Download
XC2V6000-4FF1152C Overview
The XC2V6000-4FF1152C chip model is a high-performance FPGA (Field Programmable Gate Array) developed by Xilinx. It is an important member of the Virtex-II Pro series of FPGAs and is designed to meet the needs of high-end applications such as high-speed networking, digital signal processing, and embedded systems. The model offers a wide range of features, including high-speed clock management, high-speed I/O, and embedded memory.
The XC2V6000-4FF1152C chip model has a number of advantages that make it an ideal choice for a wide range of applications. It offers a high-speed clock management system, allowing for faster data processing and improved performance. The model also features a wide range of I/O capabilities, allowing for increased flexibility and scalability. Additionally, the model includes embedded memory, allowing for improved data storage and retrieval.
The XC2V6000-4FF1152C chip model is expected to experience high demand in the future, particularly in the fields of networking, digital signal processing, and embedded systems. The model's high-speed clock management system and wide range of I/O capabilities make it an ideal choice for these applications. Additionally, the model's embedded memory allows for improved data storage and retrieval, making it an ideal choice for applications that require high levels of data storage.
The XC2V6000-4FF1152C chip model is also expected to be used in networks and intelligent scenarios in the future. Its high-speed clock management system and wide range of I/O capabilities make it an ideal choice for networking applications. Additionally, its embedded memory allows for improved data storage and retrieval, making it an ideal choice for intelligent scenarios. It is also possible for the chip model to be used in fully intelligent systems, as it offers a wide range of features that make it an ideal choice for these systems.
The XC2V6000-4FF1152C chip model is designed to meet a wide range of design requirements. It offers a high-speed clock management system, allowing for faster data processing and improved performance. The model also features a wide range of I/O capabilities, allowing for increased flexibility and scalability. Additionally, the model includes embedded memory, allowing for improved data storage and retrieval.
Case studies have shown that the XC2V6000-4FF1152C chip model is an ideal choice for a wide range of applications. In one case study, the model was used to develop a high-speed network for a large enterprise. The model's high-speed clock management system and wide range of I/O capabilities allowed for increased flexibility and scalability, while its embedded memory allowed for improved data storage and retrieval.
When using the XC2V6000-4FF1152C chip model, it is important to take certain precautions. The model should be used in accordance with Xilinx's instructions, and all instructions should be followed carefully. Additionally, the model should be tested thoroughly before being used in a production environment. Finally, it is important to ensure that the model is used in a secure environment, as it is vulnerable to malicious attacks.
In conclusion, the XC2V6000-4FF1152C chip model is an ideal choice for a wide range of applications, and is expected to experience high demand in the future. The model offers a wide range of features, including high-speed clock management, high-speed I/O, and embedded memory. It is also expected to be used in networks and intelligent scenarios in the future, and is capable of being used in fully intelligent systems. The model should be used in accordance with Xilinx's instructions, and all instructions should be followed carefully.
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4,655 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $624.9600 | $624.9600 |
| 10+ | $618.2400 | $6,182.4000 |
| 100+ | $584.6400 | $58,464.0000 |
| 1000+ | $551.0400 | $275,520.0000 |
| 10000+ | $504.0000 | $504,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||