XC2V6000-4BFG957I
XC2V6000-4BFG957I
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AMD Xilinx

XC2V6000-4BFG957I


XC2V6000-4BFG957I
F20-XC2V6000-4BFG957I
Active
IC FPGA 684 I/O 957FCBGA
957-FCBGA (40x40)

XC2V6000-4BFG957I ECAD Model


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XC2V6000-4BFG957I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 8448
Total RAM Bits 2654208
Number of I/O 684
Number of Gates 6000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 957-BBGA, FCBGA
Supplier Device Package 957-FCBGA (40x40)
Base Product Number XC2V6000

XC2V6000-4BFG957I Datasheet Download


XC2V6000-4BFG957I Overview



The XC2V6000-4BFG957I is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is based on the Virtex-II Pro architecture and is a member of the Virtex-II Pro family of FPGAs. The chip is made up of 4 million system gates and has a total of 24,000 configurable logic blocks (CLBs). It has 4,096 embedded 18-Kb block RAMs and up to 192 DSP slices.


The XC2V6000-4BFG957I is capable of operating at up to 200 MHz and features low-power operation that allows it to reduce its power consumption. It also includes a built-in, high-speed 32-bit RISC processor. It has a total of 4,096 I/O pins and a total of 24,000 logic cells. It also includes a high-speed, low-power, low-skew clock distribution network.


The XC2V6000-4BFG957I is ideal for a variety of applications, including high-performance computing, embedded systems, communications, digital signal processing, and industrial automation. It is also suitable for use in high-speed, high-density, low-power applications such as wireless communications, video and image processing, and medical imaging.


In summary, the XC2V6000-4BFG957I is a powerful and versatile FPGA chip from Xilinx. It is capable of operating at up to 200 MHz and features low-power operation. It has 4 million system gates, 24,000 configurable logic blocks, 4,096 embedded 18-Kb block RAMs, up to 192 DSP slices, and 4,096 I/O pins. It is suitable for a wide range of applications, including high-performance computing, embedded systems, communications, digital signal processing, and industrial automation.



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