XC2V500-4FG456I

The XC2V500-4FG456I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is part of the Virtex-II Pro series and is based on the Virtex-II Pro platform. This chip is a high performance, low power FPGA, featuring four million system gates, up to 500Kbits of on-chip RAM, and up to 456 I/O pins. It is also equipped with Xilinx’s Advanced eXtensible Interface (AXI) and RocketIO transceivers for high speed data transfer.

The chip has a 0.15-micron process technology and is designed to operate at a maximum frequency of 300 MHz. It has a power dissipation of 4.5W and a maximum operating temperature of 85°C. It is available in a variety of packages, including Fine-Pitch Ball Grid Array (FBGA), Fine-Pitch Leadless Chip Carrier (FLCC), and Plastic Quad Flat Pack (PQFP).

The XC2V500-4FG456I is suitable for a wide range of applications, including high-performance computing, embedded systems, and communications systems. It is also well-suited for applications requiring high-speed data transfer, such as video processing, automotive systems, and medical imaging. It can be used in a variety of systems, such as servers, switches, routers, and storage systems.

In summary, the XC2V500-4FG456I is a high-performance, low-power FPGA chip with four million system gates, up to 500Kbits of on-chip RAM, and up to 456 I/O pins. It has a 0.15-micron process technology and is designed to operate at a maximum frequency of 300 MHz. It is suitable for a wide range of applications, including high-performance computing, embedded systems, and communications systems.