AMD Xilinx
XC2V3000-6FGG676I
XC2V3000-6FGG676I ECAD Model
XC2V3000-6FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 484 | |
| Number of Outputs | 484 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA676,26X26,40 | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-6FGG676I Datasheet Download
XC2V3000-6FGG676I Overview
The XC2V3000-6FGG676I is a chip model developed by Xilinx, a leading provider of programmable logic solutions. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. Xilinx's FPGA solutions are well-suited for these applications because of their flexibility, scalability, and performance.
The XC2V3000-6FGG676I is ideal for use in a variety of industries, such as aerospace, automotive, defense, and medical. It has several advantages, such as low power consumption, high speed, and scalability. It is also designed to support a wide range of HDL languages, including Verilog and VHDL. This makes it easy for developers to use the chip model for their applications.
The XC2V3000-6FGG676I is expected to become increasingly popular in the future. This is due to the growing demand for high-performance, low-power digital signal processing and embedded processing solutions. As the technology continues to advance, the chip model will become even more powerful and efficient.
The XC2V3000-6FGG676I can also be used in the development of intelligent robots. This is due to its high-speed performance, scalability, and flexibility. To use the chip model effectively, developers need to have a good understanding of HDL languages and robotics. They should also be familiar with the hardware design process and be able to troubleshoot any issues that may arise.
In conclusion, the XC2V3000-6FGG676I is a powerful and efficient chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is expected to become increasingly popular in the future due to its low power consumption, high speed, and scalability. It can also be used in the development of intelligent robots, but developers need to have a good understanding of HDL languages and robotics to use the chip model effectively.
You May Also Be Interested In
2,427 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||