XC2V3000-6FGG676C
XC2V3000-6FGG676C
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AMD Xilinx

XC2V3000-6FGG676C


XC2V3000-6FGG676C
F20-XC2V3000-6FGG676C
Active
IC FPGA 484 I/O 676FBGA
676-FBGA (27x27)

XC2V3000-6FGG676C ECAD Model


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XC2V3000-6FGG676C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 3584
Total RAM Bits 1769472
Number of I/O 484
Number of Gates 3000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC2V3000

XC2V3000-6FGG676C Datasheet Download


XC2V3000-6FGG676C Overview



The XC2V3000-6FGG676C is a high-performance, low-cost, field-programmable gate array (FPGA) chip from Xilinx. It is designed for use in a variety of applications, including communications, storage, and consumer electronics.


The XC2V3000-6FGG676C is a 6-input, 6-output FPGA with a maximum operating frequency of up to 300 MHz. It has a total of 6,676 logic cells and a total of 4,096 bits of distributed RAM. It also includes a total of 6 DSP slices, which can be used for digital signal processing applications. It has a total of 6 I/O banks, each with up to 36 I/O pins.


The XC2V3000-6FGG676C is a low-power device, consuming only 1.2 W at a maximum operating frequency of 300 MHz. It has a maximum power dissipation of 2.5 W. It is also RoHS-compliant, making it an environmentally friendly choice.


The XC2V3000-6FGG676C is ideal for a wide range of applications, including communications, storage, and consumer electronics. It is suitable for use in a variety of systems, such as wireless communication systems, digital video systems, and deep learning systems. It can also be used in a variety of embedded applications, such as automotive, industrial, and medical applications. The device is also suitable for use in a wide range of FPGA-based designs, such as high-speed serial link designs.



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