
AMD Xilinx
XC2V3000-6FGG676C
XC2V3000-6FGG676C ECAD Model
XC2V3000-6FGG676C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 3584 | |
Total RAM Bits | 1769472 | |
Number of I/O | 484 | |
Number of Gates | 3000000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Base Product Number | XC2V3000 |
XC2V3000-6FGG676C Datasheet Download
XC2V3000-6FGG676C Overview
The XC2V3000-6FGG676C is a high-performance, low-cost, field-programmable gate array (FPGA) chip from Xilinx. It is designed for use in a variety of applications, including communications, storage, and consumer electronics.
The XC2V3000-6FGG676C is a 6-input, 6-output FPGA with a maximum operating frequency of up to 300 MHz. It has a total of 6,676 logic cells and a total of 4,096 bits of distributed RAM. It also includes a total of 6 DSP slices, which can be used for digital signal processing applications. It has a total of 6 I/O banks, each with up to 36 I/O pins.
The XC2V3000-6FGG676C is a low-power device, consuming only 1.2 W at a maximum operating frequency of 300 MHz. It has a maximum power dissipation of 2.5 W. It is also RoHS-compliant, making it an environmentally friendly choice.
The XC2V3000-6FGG676C is ideal for a wide range of applications, including communications, storage, and consumer electronics. It is suitable for use in a variety of systems, such as wireless communication systems, digital video systems, and deep learning systems. It can also be used in a variety of embedded applications, such as automotive, industrial, and medical applications. The device is also suitable for use in a wide range of FPGA-based designs, such as high-speed serial link designs.
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Pricing (USD)
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