XC2V3000-6FF1152C
XC2V3000-6FF1152C
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AMD Xilinx

XC2V3000-6FF1152C


XC2V3000-6FF1152C
F20-XC2V3000-6FF1152C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

XC2V3000-6FF1152C ECAD Model


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XC2V3000-6FF1152C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 720
Number of Outputs 720
Number of Logic Cells 32256
Number of Equivalent Gates 3000000
Number of CLBs 3584
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3584 CLBS, 3000000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description BGA, BGA1152,34X34,40
Pin Count 1152
ECCN Code 3A001.A.7.A

XC2V3000-6FF1152C Datasheet Download


XC2V3000-6FF1152C Overview



The XC2V3000-6FF1152C chip model is a high-performance programmable logic device that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. The chip model was designed with a specific focus on applications that require the use of HDL language, making it an ideal choice for such projects.


The XC2V3000-6FF1152C chip model offers a number of advantages over other models, such as its high-speed and low-power capabilities, as well as its flexibility to be programmed in a variety of ways. This makes it an ideal choice for a wide range of applications, from consumer electronics to industrial automation. Additionally, the chip model is designed with scalability in mind, allowing for future upgrades and expansions to meet the ever-evolving needs of its intended users.


The XC2V3000-6FF1152C chip model is also a great choice for advanced communication systems. Its high-speed capabilities and flexibility make it ideal for connecting multiple devices over a network, allowing for greater control and efficiency. Additionally, its low-power consumption makes it an excellent choice for mobile applications, where battery life is a major concern.


The XC2V3000-6FF1152C chip model is expected to remain in high demand in the future. As more and more applications require the use of HDL language, the XC2V3000-6FF1152C chip model will continue to be a popular choice for its high-speed, low-power capabilities and flexibility. Additionally, its scalability makes it an ideal choice for future upgrades and expansions, allowing users to stay ahead of the curve.


Overall, the XC2V3000-6FF1152C chip model is an excellent choice for a wide range of applications, from consumer electronics to advanced communication systems. Its high-speed, low-power capabilities, flexibility, and scalability make it a great choice for any project that requires the use of HDL language. With its original design intention in mind and its potential for future upgrades, the XC2V3000-6FF1152C chip model is sure to remain in high demand in the future.



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Unit Price: $384.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $357.1200 $357.1200
10+ $353.2800 $3,532.8000
100+ $334.0800 $33,408.0000
1000+ $314.8800 $157,440.0000
10000+ $288.0000 $288,000.0000
The price is for reference only, please refer to the actual quotation!

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