XC2V3000-5FGG676I
XC2V3000-5FGG676I
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rohs

AMD Xilinx

XC2V3000-5FGG676I


XC2V3000-5FGG676I
F20-XC2V3000-5FGG676I
Active
IC FPGA 484 I/O 676FBGA
676-FBGA (27x27)

XC2V3000-5FGG676I ECAD Model


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XC2V3000-5FGG676I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 3584
Total RAM Bits 1769472
Number of I/O 484
Number of Gates 3000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC2V3000

XC2V3000-5FGG676I Datasheet Download


XC2V3000-5FGG676I Overview



The XC2V3000-5FGG676I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Virtex-II Pro architecture and is designed for high-performance, low-power applications.


The chip has a total of 5,184 logic cells and 676 I/Os. It features 676 user-configurable I/O pins and a total of 5,184 logic cells. It also has two external clock pins, four global clock lines, and four dedicated clock lines. The chip has various features such as high-speed transceivers, differential I/O, and low-power configuration.


The XC2V3000-5FGG676I is suitable for a wide range of applications such as communications, consumer electronics, automotive, industrial, and medical. It can be used for high-speed, low-power designs such as Ethernet, USB, and Serial ATA. It is also suitable for designs requiring high-density logic and I/O, such as video and image processing, as well as for designs requiring high-performance and low-power, such as automotive and industrial control.


The XC2V3000-5FGG676I is a highly reliable, cost-effective chip that can be used for a variety of applications. It is available in a range of packages, including ball grid array (BGA), quad flat pack (QFP), and thin small-outline package (TSOP). It is also RoHS compliant and can be used in a variety of temperature ranges.



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