XC2V3000-4FGG676I

The XC2V3000-4FGG676I is a field programmable gate array (FPGA) chip from Xilinx, Inc. It is a member of the Virtex-II family of FPGAs. The XC2V3000-4FGG676I has 4 million system gates, 4,096 logic cells, and 4,096 distributed RAM blocks. It also has 4,096 flip-flops and 4,096 I/O blocks, with up to 676 I/O pins. The chip is designed to operate at a maximum frequency of 200 MHz. It has a power supply voltage range of 1.2V to 3.3V and a maximum operating temperature of 85°C.

The XC2V3000-4FGG676I is suitable for a wide range of applications, including high-speed data acquisition, digital signal processing, embedded control, and communication systems. It is also suitable for high-performance computing, high-speed networking, and image processing. Its high-speed I/O, integrated memory blocks, and system-level integration make it ideal for high-speed, low-power applications.

The XC2V3000-4FGG676I is designed to provide maximum system performance. It features advanced features such as PowerPC™ microprocessor, dual-port memory, and high-speed transceivers. It also has a wide range of I/O options, including LVDS, LVCMOS, and differential I/O. The chip also has advanced security features, such as on-chip encryption and authentication, to protect data and intellectual property.

In summary, the XC2V3000-4FGG676I is a high-performance FPGA chip from Xilinx, Inc. It has 4 million system gates, 4,096 logic cells, and 4,096 distributed RAM blocks. It has a maximum operating frequency of 200 MHz, a power supply voltage range of 1.2V to 3.3V, and a maximum operating temperature of 85°C. It is suitable for a wide range of applications, including high-speed data acquisition, digital signal processing, embedded control, and communication systems.