XC2V3000-4FFG1152I
XC2V3000-4FFG1152I
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rohs

AMD Xilinx

XC2V3000-4FFG1152I


XC2V3000-4FFG1152I
F20-XC2V3000-4FFG1152I
Active
IC FPGA 720 I/O 1152FCBGA
1152-FCBGA (35x35)

XC2V3000-4FFG1152I ECAD Model


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XC2V3000-4FFG1152I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 3584
Total RAM Bits 1769472
Number of I/O 720
Number of Gates 3000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number XC2V3000

XC2V3000-4FFG1152I Datasheet Download


XC2V3000-4FFG1152I Overview



The XC2V3000-4FFG1152I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a member of the Virtex-II family of FPGAs and is based on the Virtex-II architecture. It has a total of 11,520 logic cells, 8,192 flip-flops and 4,608 four-input look-up tables (LUTs). It also has 6,144 embedded block RAMs (BRAMs) with a total memory of 24,576 bits. It is capable of operating at speeds of up to 300 MHz and has a total power dissipation of 5.5 W.


This chip is suitable for a wide range of applications, including high-speed data acquisition, image processing, and communications. It can also be used for high-performance computing, control systems, and embedded systems. It is ideal for applications that require high speed and low power consumption.


The chip also features an integrated clock management system, which enables it to handle multiple clock domains and clock frequencies. It is also capable of supporting up to 48 differential I/O pairs and has an integrated JTAG controller for debugging and programming.


In addition, the XC2V3000-4FFG1152I is designed to be used in harsh environments. It is rated for operation in temperatures ranging from -40°C to 85°C and is compliant with the RoHS directive. It also features a built-in power-on reset and is designed to be used in high-reliability systems.



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