
AMD Xilinx
XC2V3000-4FF1152C
XC2V3000-4FF1152C ECAD Model
XC2V3000-4FF1152C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 720 | |
Number of Outputs | 720 | |
Number of Logic Cells | 32256 | |
Number of Equivalent Gates | 3000000 | |
Number of CLBs | 3584 | |
Combinatorial Delay of a CLB-Max | 440 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3584 CLBS, 3000000 GATES | |
Clock Frequency-Max | 650 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1152,34X34,40 | |
Pin Count | 1152 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2V3000-4FF1152C Datasheet Download
XC2V3000-4FF1152C Overview
The chip model XC2V3000-4FF1152C is an important part of the semiconductor industry and is widely used in various applications. With the development of the industry, the chip model continues to evolve and become more powerful. It is capable of providing powerful computing capabilities and is used in many different fields.
In the current industry trend, the chip model XC2V3000-4FF1152C is being used in networks, as well as intelligent systems. It is capable of providing powerful computing capabilities and is being used in various applications. It is also being used in the development and popularization of future intelligent robots. This chip model is able to provide powerful computing capabilities and is capable of providing a wide range of capabilities.
In the future, the chip model XC2V3000-4FF1152C will continue to evolve and become more powerful. It is possible that this chip model will be used in future intelligent systems, as well as in the development and popularization of future intelligent robots. It is also possible that this chip model will be used in the era of fully intelligent systems.
In order to use the chip model XC2V3000-4FF1152C effectively, certain technical talents are needed. These include software engineers, hardware engineers, and data scientists. These professionals need to have a deep understanding of the chip model and be able to design and develop applications that utilize the chip model’s capabilities.
Therefore, the chip model XC2V3000-4FF1152C has a bright future in the semiconductor industry. It is capable of providing powerful computing capabilities and is being used in many different fields. It is also being used in the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are needed. With the development of the industry, the chip model continues to evolve and become more powerful, and it is possible that this chip model will be used in the era of fully intelligent systems.
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4,316 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $655.8402 | $655.8402 |
10+ | $648.7881 | $6,487.8814 |
100+ | $613.5279 | $61,352.7915 |
1000+ | $578.2677 | $289,133.8450 |
10000+ | $528.9034 | $528,903.3750 |
The price is for reference only, please refer to the actual quotation! |