
AMD Xilinx
XC2V250-6FGG456C
XC2V250-6FGG456C ECAD Model
XC2V250-6FGG456C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 384 | |
Total RAM Bits | 442368 | |
Number of I/O | 200 | |
Number of Gates | 250000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 456-BBGA | |
Supplier Device Package | 456-FBGA (23x23) | |
Base Product Number | XC2V250 |
XC2V250-6FGG456C Datasheet Download
XC2V250-6FGG456C Overview
The XC2V250-6FGG456C is a low-cost FPGA (Field Programmable Gate Array) chip model manufactured by Xilinx. It is a member of the Virtex-II family and provides a high logic capacity of 250K system gates. This device is based on the Xilinx Virtex-II Platform FPGA which uses the 0.18μm Virtex-II 6-layer metal process technology. The chip offers a wide range of features such as fast, low-skew clock distribution, high-speed transceivers, and support for various high-speed I/O standards.
The XC2V250-6FGG456C has a total of 456 I/O pins, including two dedicated clock input pins. It also includes two dedicated JTAG pins for programming and debugging. The device is capable of operating at a maximum speed of 200MHz and has a total power dissipation of 3.2W at 3.3V. The chip has an operating temperature range of 0°C to 70°C and is available in a PQFP package.
The XC2V250-6FGG456C is suitable for use in a variety of applications, such as automotive, consumer, and industrial applications. It can be used for applications such as digital signal processing, embedded system design, and high-speed networking. It is also suitable for applications where low-cost and low-power FPGA solutions are required.
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Pricing (USD)
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