
AMD Xilinx
XC2V250-5FGG456C
XC2V250-5FGG456C ECAD Model
XC2V250-5FGG456C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 384 | |
Total RAM Bits | 442368 | |
Number of I/O | 200 | |
Number of Gates | 250000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 456-BBGA | |
Supplier Device Package | 456-FBGA (23x23) | |
Base Product Number | XC2V250 |
XC2V250-5FGG456C Datasheet Download
XC2V250-5FGG456C Overview
The XC2V250-5FGG456C is a field programmable gate array (FPGA) chip manufactured by Xilinx, Inc. This chip model is based on Xilinx's Virtex-II Pro FPGA architecture and is designed for high performance, low power applications.
The XC2V250-5FGG456C chip model features 250K system gates, 1.2 million system logic cells, and 4.56 million bits of embedded memory. It also includes 4 power-optimized, low-power, high-speed DSP48A1 slices, as well as support for up to 8 power-managed I/O banks. The chip is fabricated using a 0.13μm process technology and is capable of operating at speeds up to 250MHz.
The XC2V250-5FGG456C chip model is suitable for a wide range of applications, including data communications, wireless, imaging, video, audio, industrial, and automotive applications. It can be used to implement complex designs that require high levels of integration, high speed, and low power consumption.
In addition, the XC2V250-5FGG456C chip model is compatible with Xilinx's ISE design suite and is supported by a wide range of development tools and software libraries. This makes it easy to create, debug, and deploy applications on the chip. It is also available in a variety of packages, including BGA, PQFP, and VFBGA.
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