XC2V250-5FGG456C
XC2V250-5FGG456C
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AMD Xilinx

XC2V250-5FGG456C


XC2V250-5FGG456C
F20-XC2V250-5FGG456C
Active
IC FPGA 200 I/O 456FBGA
456-FBGA (23x23)

XC2V250-5FGG456C ECAD Model


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XC2V250-5FGG456C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 384
Total RAM Bits 442368
Number of I/O 200
Number of Gates 250000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Base Product Number XC2V250

XC2V250-5FGG456C Datasheet Download


XC2V250-5FGG456C Overview



The XC2V250-5FGG456C is a field programmable gate array (FPGA) chip manufactured by Xilinx, Inc. This chip model is based on Xilinx's Virtex-II Pro FPGA architecture and is designed for high performance, low power applications.


The XC2V250-5FGG456C chip model features 250K system gates, 1.2 million system logic cells, and 4.56 million bits of embedded memory. It also includes 4 power-optimized, low-power, high-speed DSP48A1 slices, as well as support for up to 8 power-managed I/O banks. The chip is fabricated using a 0.13μm process technology and is capable of operating at speeds up to 250MHz.


The XC2V250-5FGG456C chip model is suitable for a wide range of applications, including data communications, wireless, imaging, video, audio, industrial, and automotive applications. It can be used to implement complex designs that require high levels of integration, high speed, and low power consumption.


In addition, the XC2V250-5FGG456C chip model is compatible with Xilinx's ISE design suite and is supported by a wide range of development tools and software libraries. This makes it easy to create, debug, and deploy applications on the chip. It is also available in a variety of packages, including BGA, PQFP, and VFBGA.



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