AMD Xilinx
XC2V250-4FGG456C
XC2V250-4FGG456C ECAD Model
XC2V250-4FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Virtex®-II | |
| Package | Tray | |
| Number of LABs/CLBs | 384 | |
| Total RAM Bits | 442368 | |
| Number of I/O | 200 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425V ~ 1.575V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 456-BBGA | |
| Supplier Device Package | 456-FBGA (23x23) | |
| Base Product Number | XC2V250 |
XC2V250-4FGG456C Datasheet Download
XC2V250-4FGG456C Overview
The XC2V250-4FGG456C is a field-programmable gate array (FPGA) chip from Xilinx. It is based on the Virtex-II Pro series and is built with a 0.18-micron process technology. This FPGA chip has 4 million system gates, 2.2 million flip-flops, 1,000 I/O blocks, and 256Kbits of block RAM. It also features 4 clock management tiles and 16 DLLs (delay-locked loops).
The XC2V250-4FGG456C is suitable for a wide range of applications. It is used in high-speed data acquisition systems, digital signal processing, embedded processor designs, and high-performance networking applications. It also supports a wide range of I/O standards, including LVDS, LVPECL, SSTL, and GTL.
The chip has a power dissipation of 7.5W, and a maximum operating frequency of 250MHz. It is available in a 456-pin, 7.5mm x 10mm, fine-pitch, FBGA package. It has a dynamic power dissipation of 1.3W, and a static power dissipation of 6.2W.
The XC2V250-4FGG456C is a high-performance, cost-effective FPGA solution that is suitable for a wide range of applications. It is a reliable, versatile and easy to use chip that is suitable for a wide range of applications.
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