
AMD Xilinx
XC2V2000-6FGG676C
XC2V2000-6FGG676C ECAD Model
XC2V2000-6FGG676C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 2688 | |
Total RAM Bits | 1032192 | |
Number of I/O | 456 | |
Number of Gates | 2000000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Base Product Number | XC2V2000 |
XC2V2000-6FGG676C Datasheet Download
XC2V2000-6FGG676C Overview
The XC2V2000-6FGG676C is a low-cost, low-power field-programmable gate array (FPGA) chip from Xilinx. It is based on the Virtex-II Pro architecture, and is fabricated using a 0.15-micron, six-layer metal CMOS process. This chip is suitable for applications in the communications, industrial, automotive and aerospace industries.
The XC2V2000-6FGG676C FPGA offers a total of 2 million system gates and up to 576 user I/O pins. It also features an internal clock frequency of up to 200 MHz and a maximum operating temperature of 85 degrees Celsius. The chip offers a wide range of features including high-speed serial transceivers, differential I/O, clock management and power management.
The XC2V2000-6FGG676C is a highly versatile chip that can be used in a variety of applications including high-speed networking, wireless communication, image processing, video processing and embedded systems. It is also suitable for applications that require fast processing, low power consumption and high reliability.
The XC2V2000-6FGG676C FPGA is a reliable, cost-effective solution for a wide range of applications. It offers a high level of performance, flexibility and scalability, making it an ideal choice for a variety of applications.
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