AMD Xilinx
XC2V2000-5BGG728C
XC2V2000-5BGG728C ECAD Model
XC2V2000-5BGG728C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B728 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 728 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 728 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V2000-5BGG728C Datasheet Download
XC2V2000-5BGG728C Overview
The XC2V2000-5BGG728C chip model is a high-performance device that is suitable for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it a powerful tool for engineers and developers. With its advanced features, the chip model is increasingly becoming popular in the industry.
The chip model is capable of handling complex tasks and is increasingly being used in a variety of applications. It is being used in high-end digital signal processing, embedded processing, image processing, and other applications. This chip model is not only efficient but also reliable, making it a great choice for many applications.
As the industry continues to evolve, the chip model is likely to be used in a variety of new applications. The chip model can be used in networks, intelligent scenarios, and even in fully intelligent systems. In the future, the chip model is likely to be used in a variety of applications, including the Internet of Things, smart homes, and autonomous vehicles.
The chip model is also likely to be used in a variety of new technologies. This could include artificial intelligence, blockchain, and quantum computing. With these technologies, the chip model can be used in a variety of applications, from data analysis to autonomous driving.
The chip model is a powerful tool for developers. It is capable of handling complex tasks and is increasingly being used in a variety of applications. As the industry evolves, the chip model is likely to be used in a variety of new applications and technologies. This could include artificial intelligence, blockchain, and quantum computing. With these technologies, the chip model can be used in a variety of applications, from data analysis to autonomous driving.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||