AMD Xilinx
XC2V2000-4BG957C
XC2V2000-4BG957C ECAD Model
XC2V2000-4BG957C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | HBGA, | |
| Pin Count | 957 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V2000-4BG957C Datasheet Download
XC2V2000-4BG957C Overview
The Xilinx XC2V2000-4BG957C is a Field Programmable Gate Array (FPGA) that is designed to offer a wide range of features and capabilities. It is a powerful chip model that is used in a variety of applications, such as embedded systems, industrial automation, and communication systems.
The XC2V2000-4BG957C is designed with the intention of providing high performance and enhanced flexibility. It is capable of supporting a wide range of technologies, such as high-speed serial I/O, DDR3 memory controllers, multi-gigabit transceivers, and high-speed SERDES. It also has the capability to support various types of communication protocols, such as Ethernet, USB, and PCI.
The XC2V2000-4BG957C is expected to have a high demand in the future, as it is capable of providing speed and flexibility. It is also expected to be used in various industries, such as automotive, medical, and aerospace. This chip model can be used in a variety of communication systems, such as wireless, wired, and optical networks. It is also capable of supporting advanced communication systems, such as 5G networks.
The XC2V2000-4BG957C is designed to be upgradable, and it is expected to be able to support new technologies in the future. It is capable of supporting multiple protocols and standards, such as Ethernet, USB, PCI, and 5G. This chip model is also expected to be able to support advanced communication systems, such as 5G networks.
In conclusion, the Xilinx XC2V2000-4BG957C is a powerful chip model that is designed to provide high performance and flexibility. It is expected to have a high demand in the future, as it is capable of supporting a wide range of technologies and communication protocols. It is also expected to be able to support advanced communication systems, such as 5G networks. It is designed to be upgradable, and it is expected to be able to support new technologies in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||