XC2V1500-6FGG676I
XC2V1500-6FGG676I
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rohs

AMD Xilinx

XC2V1500-6FGG676I


XC2V1500-6FGG676I
F20-XC2V1500-6FGG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA676,26X26,40
BGA, BGA676,26X26,40

XC2V1500-6FGG676I ECAD Model


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XC2V1500-6FGG676I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 392
Number of Outputs 392
Number of Logic Cells 17280
Number of Equivalent Gates 1500000
Number of CLBs 1920
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1920 CLBS, 1500000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA676,26X26,40
Pin Count 676
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC2V1500-6FGG676I Datasheet Download


XC2V1500-6FGG676I Overview



The chip model XC2V1500-6FGG676I is a highly advanced and powerful Integrated Circuit (IC) designed to meet the needs of a wide range of application environments. It is a member of the Xilinx Virtex-II family of Field Programmable Gate Arrays (FPGAs), and is one of the most powerful and versatile ICs available today.


The XC2V1500-6FGG676I is designed to provide a high-performance, low-cost solution for a variety of applications. It provides a wide range of features, including high-speed I/O, multiple clock domains, and advanced logic synthesis capabilities. The chip also has a number of power management features, including dynamic voltage scaling and power-down modes.


The XC2V1500-6FGG676I is designed to provide a low-cost solution for a variety of applications, including high-speed networking, embedded systems, and industrial automation. It is also suitable for use in high-end consumer electronics, such as digital cameras and camcorders.


In terms of industry trends, the XC2V1500-6FGG676I is expected to be in high demand in the coming years. This is due to its low cost, high performance, and wide range of features. It is also expected to be in high demand in the automotive and aerospace industries, due to its high-speed I/O and power management features.


The XC2V1500-6FGG676I is designed to meet the specific needs of various application environments. It is capable of supporting a wide range of technologies, including DDR3, QDRII, and SERDES. It also supports high-speed I/O, multiple clock domains, and advanced logic synthesis capabilities.


When designing with the XC2V1500-6FGG676I, it is important to consider the specific requirements of the application environment. This includes the power requirements, the number of I/O pins, and the specific features needed. It is also important to consider the specific design requirements of the chip, such as the number of logic cells, the number of I/O pins, and the number of clock domains.


In order to ensure the reliable operation of the chip, it is important to consider the specific design requirements of the application environment. This includes the power requirements, the number of I/O pins, and the specific features needed. It is also important to consider the specific design requirements of the chip, such as the number of logic cells, the number of I/O pins, and the number of clock domains.


When designing with the XC2V1500-6FGG676I, it is important to consider the specific requirements of the application environment. It is also important to consider the specific design requirements of the chip, such as the number of logic cells, the number of I/O pins, and the number of clock domains. It is also important to consider the specific design requirements of the application environment, such as the power requirements, the number of I/O pins, and the specific features needed.


The XC2V1500-6FGG676I is a powerful and versatile IC that is expected to be in high demand in the coming years. It is designed to provide a low-cost solution for a variety of applications. It is also capable of supporting a wide range of technologies, including DDR3, QDRII, and SERDES. When designing with the XC2V1500-6FGG676I, it is important to consider the specific requirements of the application environment, as well as the specific design requirements of the chip. By doing so, designers can ensure that the chip is able to meet the needs of their application environment and provide reliable performance.



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