XC2V1000-6FGG456C
XC2V1000-6FGG456C
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AMD Xilinx

XC2V1000-6FGG456C


XC2V1000-6FGG456C
F20-XC2V1000-6FGG456C
Active
IC FPGA 324 I/O 456FBGA
456-FBGA (23x23)

XC2V1000-6FGG456C ECAD Model


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XC2V1000-6FGG456C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 1280
Total RAM Bits 737280
Number of I/O 324
Number of Gates 1000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Base Product Number XC2V1000

XC2V1000-6FGG456C Datasheet Download


XC2V1000-6FGG456C Overview



The XC2V1000-6FGG456C is a field programmable gate array (FPGA) chip manufactured by Xilinx. It is a Virtex-II Pro device that is based on the Virtex-II Pro platform. It has a capacity of 1 million system gates and is designed to provide high performance, low power and low cost.


The XC2V1000-6FGG456C is a 6-layer device with a 456-pin BGA package. It has a maximum power consumption of 7.5W and a maximum operating temperature of 85°C. It has a maximum clock frequency of 200 MHz and can support up to 16 user-defined I/Os. It also has four high-speed dedicated I/Os, four multi-gigabit transceivers, and two clock management tiles.


The XC2V1000-6FGG456C is suitable for a wide range of applications including digital signal processing, embedded systems, networking, storage, and video. It can be used for high-speed data transfer, image processing, video processing, and other applications that require high performance and low power consumption.


The XC2V1000-6FGG456C is a reliable and cost-effective FPGA chip that can provide high performance and low power consumption for a wide range of applications. It is a suitable choice for applications that require high speed data transfer, image processing, and video processing.



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