XC2V1000-4BGG575C

The XC2V1000-4BGG575C is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is based on the Virtex-II Pro platform and is optimized for high-performance applications. The chip is composed of 4.5 million system gates and can be used to implement a wide range of functions, including digital signal processing, embedded processing, and system control.

The XC2V1000-4BGG575C features four Virtex-II Pro slices with two embedded PowerPC 405 cores, each with a 32-bit RISC processor and a 16-bit multiplier. It also includes two independent clock management units, two independent Gigabit Ethernet cores, two independent PCI Express cores, and two independent USB 2.0 cores. The chip has a total of 4,096 I/O pins, with 4,096 user I/O pins and 1,024 differential I/O pins.

The XC2V1000-4BGG575C has a maximum operating frequency of 250 MHz and a maximum power dissipation of 6.5 W. It is designed to be used in a variety of applications, including wireless communications, medical imaging, industrial automation, and automotive. It is also suitable for use in high-speed networking, video processing, and embedded applications. The chip is available in a variety of packages, including a BGA-575 package and a BGA-1076 package.