AMD Xilinx
XC2S600E-7FGG676C
XC2S600E-7FGG676C ECAD Model
XC2S600E-7FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S600E-7FGG676C Datasheet Download
XC2S600E-7FGG676C Overview
The XC2S600E-7FGG676C chip model is a versatile and powerful model that is suitable for a variety of applications in the digital signal processing, embedded processing, and image processing industries. The model supports the use of HDL language, making it a popular choice for companies looking for a reliable and cost-effective solution for their projects.
The chip model XC2S600E-7FGG676C has a number of advantages that make it an attractive choice for companies looking to stay ahead of the technology curve. For example, the model is capable of high-performance digital signal processing, embedded processing, and image processing, making it a great choice for projects that require these features. Additionally, the model is designed to be energy-efficient and reliable, making it a great choice for projects that require long-term usage.
The future of the chip model XC2S600E-7FGG676C and related industries is dependent on what technologies are needed. As new technologies are developed, the chip model XC2S600E-7FGG676C will be able to keep up with the pace of technological advancement. Additionally, as more companies recognize the advantages of the chip model, the demand for it is expected to increase.
Overall, the chip model XC2S600E-7FGG676C is a great choice for companies looking for a reliable and cost-effective solution for their projects. With its versatile capabilities, energy-efficiency, and reliability, the chip model is sure to be a popular choice for a variety of applications in the digital signal processing, embedded processing, and image processing industries. As technology continues to advance, the chip model XC2S600E-7FGG676C will be able to keep up with the pace of technological advancement, leading to an increased demand for it in the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||