AMD Xilinx
XC2S600E-7FG676C
XC2S600E-7FG676C ECAD Model
XC2S600E-7FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S600E-7FG676C Datasheet Download
XC2S600E-7FG676C Overview
The XC2S600E-7FG676C chip model is an integrated circuit (IC) from Xilinx, a leading provider of programmable logic solutions. It is a field-programmable gate array (FPGA) device built on the Virtex-II Pro platform, which is optimized for high-performance, low-power applications. This chip model is designed to meet the needs of today's most demanding applications, such as high-speed communication systems and embedded systems.
The XC2S600E-7FG676C provides a high-performance, low-power solution for a wide variety of applications. It features a high-performance, high-density logic fabric that allows for rapid development of complex logic designs. Additionally, it provides a wide variety of high-performance I/O and memory interfaces, as well as a wide range of configurable options. This chip model is also designed with a low-power architecture, allowing for low-power operation and reduced system costs.
The XC2S600E-7FG676C is designed to meet the needs of today's most demanding applications. It is a highly-scalable solution that can be used in a variety of applications, including high-speed communication systems, embedded systems, and digital signal processing (DSP) applications. Additionally, it is capable of supporting advanced communication systems, such as IEEE 802.11a/b/g/n, WiMAX, and Zigbee, as well as other high-speed communication protocols.
The XC2S600E-7FG676C is designed with a modular architecture, allowing for future upgrades and enhancements. This model is also designed with a high level of configurability, allowing for a wide range of customization options. Additionally, it is designed with a low-power architecture, allowing for low-power operation and reduced system costs.
The XC2S600E-7FG676C provides a high-performance, low-power solution for a wide variety of applications. It is designed to meet the needs of today's most demanding applications, such as high-speed communication systems and embedded systems. Additionally, it is capable of supporting advanced communication systems, such as IEEE 802.11a/b/g/n, WiMAX, and Zigbee, as well as other high-speed communication protocols.
In terms of product description, the XC2S600E-7FG676C is a field-programmable gate array (FPGA) device built on the Virtex-II Pro platform, which is optimized for high-performance, low-power applications. It features a high-performance, high-density logic fabric that allows for rapid development of complex logic designs. Additionally, it provides a wide variety of high-performance I/O and memory interfaces, as well as a wide range of configurable options.
In terms of actual case studies, the XC2S600E-7FG676C has been used in a variety of applications, including high-speed communication systems, embedded systems, and digital signal processing (DSP) applications. Additionally, it has been used in advanced communication systems, such as IEEE 802.11a/b/g/n, WiMAX, and Zigbee, as well as other high-speed communication protocols.
In terms of precautions, it is important to note that the XC2S600E-7FG676C is a highly-scalable solution that can be used in a variety of applications. It is important to ensure that the chip model is properly configured for the application in order to achieve optimal performance and reliability. Additionally, it is important to ensure that the chip model is compatible with the system in which it will be used.
In terms of future demand trends, the XC2S600E-7FG676C is expected to remain in high demand due to its high-performance, low-power solution. It is expected to be used in a variety of applications, including high-speed communication systems, embedded systems, and digital signal processing (DSP) applications. Additionally, it is expected to be used in advanced communication systems, such as IEEE 802.11a/b/g/n, WiMAX, and Zigbee, as well as other high-speed communication protocols.
Overall, the XC2S600E-7FG676C is a highly-scalable solution that can be used in a variety of applications. It is designed to meet the needs of today's most demanding applications, such as high-speed communication systems and embedded systems. Additionally, it is capable of supporting advanced communication systems, such as IEEE 802.11a/b/g/n, WiMAX, and Zigbee, as well as other high-speed communication protocols. It is expected to remain in high demand due to its high-performance, low-power solution, and it is important to ensure that the chip model is properly
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