AMD Xilinx
XC2S600E-7FG456C
XC2S600E-7FG456C ECAD Model
XC2S600E-7FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S600E-7FG456C Datasheet Download
XC2S600E-7FG456C Overview
The XC2S600E-7FG456C chip model is a high performance, low-power FPGA from Xilinx. It is designed for high-performance digital signal processing, embedded processing, and image processing applications. It is capable of handling a wide range of tasks, including high-speed data processing, low-power operation, and high-speed communications.
The XC2S600E-7FG456C is an ideal choice for embedded applications, as it is capable of supporting multiple clock frequencies and can be used for a variety of applications. It is also suitable for high-performance digital signal processing, image processing, and other complex tasks. The XC2S600E-7FG456C is programmed using the HDL language, which is a powerful, yet simple, language designed for creating complex digital systems.
The XC2S600E-7FG456C chip model is capable of being used in networks and intelligent scenarios, as it is capable of performing complex tasks and can be used in the era of fully intelligent systems. It is also capable of supporting the development of autonomous systems, such as self-driving cars and robots.
In terms of product description and design requirements, the XC2S600E-7FG456C chip model is designed to be low-power, high-performance, and highly reliable. It is also capable of supporting multiple clock frequencies and can be used in a variety of applications. Furthermore, it is designed to be easy to program and debug, and can be used in a variety of programming languages.
When designing systems using the XC2S600E-7FG456C chip model, it is important to consider the specific requirements of the application. It is also important to consider the power requirements and the environment in which the system will be used. Additionally, it is important to consider the design of the system, as the chip model will need to be programmed and debugged in order for the system to work properly.
In conclusion, the XC2S600E-7FG456C chip model is a high-performance, low-power FPGA from Xilinx. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other complex tasks. It is capable of being used in networks and intelligent scenarios, as well as in the era of fully intelligent systems. Furthermore, it is designed to be low-power, high-performance, and highly reliable. When designing systems using the XC2S600E-7FG456C chip model, it is important to consider the specific requirements of the application, as well as the power requirements and the environment in which the system will be used.
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|---|---|---|
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