AMD Xilinx
XC2S600E-6FGG676I
XC2S600E-6FGG676I ECAD Model
XC2S600E-6FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | LEAD FREE, FBGA-676 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 676 |
XC2S600E-6FGG676I Datasheet Download
XC2S600E-6FGG676I Overview
The chip model XC2S600E-6FGG676I is a cutting-edge integrated circuit (IC) developed by Xilinx, a leading manufacturer of programmable logic devices. It is a highly versatile and powerful device that can be used in a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the hardware description language (HDL), making it an ideal choice for those looking to develop complex systems with the highest level of performance.
The original design intention of the XC2S600E-6FGG676I was to provide users with a powerful and flexible solution for their application needs. It was designed with the possibility of future upgrades in mind, allowing users to tailor the device to their specific requirements. This makes the XC2S600E-6FGG676I highly suitable for advanced communication systems, as it can be easily upgraded to meet the changing needs of the application.
In addition to its use in advanced communication systems, the XC2S600E-6FGG676I can also be used in the development and popularization of future intelligent robots. This is due to its ability to process complex data in real-time, making it ideal for use in robotics applications. To use the XC2S600E-6FGG676I effectively in this field, technical talents such as engineers, programmers, and designers are needed to develop and implement the necessary software and hardware.
In conclusion, the XC2S600E-6FGG676I chip model is a versatile and powerful device that can be used in a variety of applications. It is designed with the possibility of future upgrades in mind, making it suitable for advanced communication systems and the development and popularization of future intelligent robots. To use the XC2S600E-6FGG676I effectively, technical talents such as engineers, programmers, and designers are needed.
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3,833 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $65.2637 | $65.2637 |
| 10+ | $64.5619 | $645.6192 |
| 100+ | $61.0531 | $6,105.3120 |
| 1000+ | $57.5443 | $28,772.1600 |
| 10000+ | $52.6320 | $52,632.0000 |
| The price is for reference only, please refer to the actual quotation! | ||