AMD Xilinx
XC2S600E-6FGG456I
XC2S600E-6FGG456I ECAD Model
XC2S600E-6FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S600E-6FGG456I Datasheet Download
XC2S600E-6FGG456I Overview
The XC2S600E-6FGG456I chip model is a powerful, high-performance digital signal processor that is suitable for a variety of applications such as embedded processing, image processing, and digital signal processing. It is designed to be used with HDL (Hardware Description Language) to provide the best performance and reliability. The XC2S600E-6FGG456I chip model has several advantages that make it a desirable choice for many applications.
First, the XC2S600E-6FGG456I chip model is designed with a high speed and low power consumption. This makes it ideal for applications that require high performance with minimal energy consumption. Additionally, the chip model has a wide range of features and performance levels that can be tailored for the specific application. This makes it a great choice for a variety of applications.
Second, the XC2S600E-6FGG456I chip model is designed with a high reliability. The chip is designed to be durable and reliable in order to ensure that it can withstand the rigors of everyday use. It is also designed to be resistant to environmental factors such as temperature, humidity, and dust. This makes it a great choice for applications in harsh environments.
Finally, the XC2S600E-6FGG456I chip model is designed with a high level of integration. This means that it can be used to combine multiple functions into one chip, reducing the complexity and cost of the system. This makes it a great choice for applications that require a lot of processing power without increasing the size or cost of the system.
Due to these advantages, the XC2S600E-6FGG456I chip model has become increasingly popular in many industries. It is expected that the demand for this chip model will continue to increase in the future as more applications require high-performance digital signal processing, embedded processing, and image processing.
When designing a system that uses the XC2S600E-6FGG456I chip model, there are a few things to consider. First, designers should ensure that the chip is properly configured for the application. This means that the chip should be programmed with the correct settings and parameters so that it can perform optimally. Additionally, designers should make sure that the chip is connected to the necessary peripherals and components in order to maximize its performance.
Finally, designers should be aware of the potential risks associated with using the XC2S600E-6FGG456I chip model. For example, the chip can be damaged if it is exposed to excessive temperatures or other environmental factors. Additionally, the chip can be damaged if it is not properly programmed or connected to the necessary components. Therefore, it is important to take the necessary precautions when using the XC2S600E-6FGG456I chip model.
In summary, the XC2S600E-6FGG456I chip model is a powerful, high-performance digital signal processor that is suitable for a variety of applications. It is designed to be used with HDL (Hardware Description Language) and has a number of advantages such as high speed, low power consumption, high reliability, and high level of integration. The demand for this chip model is expected to continue to increase in the future as more applications require high-performance digital signal processing, embedded processing, and image processing. When designing a system that uses the XC2S600E-6FGG456I chip model, designers should ensure that the chip is properly configured for the application and take the necessary precautions to protect it from potential damage.
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4,336 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $89.2800 | $89.2800 |
| 10+ | $88.3200 | $883.2000 |
| 100+ | $83.5200 | $8,352.0000 |
| 1000+ | $78.7200 | $39,360.0000 |
| 10000+ | $72.0000 | $72,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||