AMD Xilinx
XC2S600E-6FG676I
XC2S600E-6FG676I ECAD Model
XC2S600E-6FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S600E-6FG676I Datasheet Download
XC2S600E-6FG676I Overview
The XC2S600E-6FG676I chip model is a high-end product designed by Xilinx Corporation, a leading provider of programmable logic solutions. It is a field-programmable gate array (FPGA) device, specifically designed for applications requiring high-speed, high-density logic. This chip model is ideal for a variety of applications, such as digital signal processing, communication systems, and embedded systems.
The XC2S600E-6FG676I chip model offers a number of advantages that make it a suitable choice for a wide range of applications. It is equipped with a 6-input look-up table (LUT) architecture, which provides a high-speed and flexible logic implementation. Additionally, its small form factor makes it perfect for applications requiring a compact design. Furthermore, the chip model is equipped with a large number of I/Os, which makes it suitable for a variety of applications.
The XC2S600E-6FG676I chip model is designed to meet the demands of the current and future communication systems. It is equipped with a number of features that make it suitable for advanced communication systems, such as high-speed serial transceivers, a wide range of I/O standards, and a variety of memory interfaces. Additionally, the chip model has the potential to be upgraded to a higher-performance version, making it a suitable choice for future communication systems.
The XC2S600E-6FG676I chip model is designed to meet specific design requirements. Its 6-input LUT architecture provides a high-speed and flexible logic implementation, while its small form factor makes it perfect for applications requiring a compact design. Additionally, its wide range of I/O standards, high-speed serial transceivers, and a variety of memory interfaces make it suitable for a wide range of applications.
There are a number of case studies that demonstrate the successful application of the XC2S600E-6FG676I chip model. For example, it has been used in a variety of communication systems, including wireless communication systems, satellite communication systems, and digital video broadcasting systems. Additionally, it has been used in a variety of embedded systems, such as medical imaging systems and automotive systems.
When using the XC2S600E-6FG676I chip model, it is important to take into account a number of precautions. It is important to ensure that the chip model is properly powered and cooled, as it is designed to operate at high speeds and high densities. Additionally, it is important to ensure that the chip model is properly configured and programmed, as improper configuration can lead to errors and malfunctions.
In conclusion, the XC2S600E-6FG676I chip model is a high-end product designed by Xilinx Corporation that is suitable for a variety of applications. It is equipped with a 6-input LUT architecture, a small form factor, and a variety of I/O standards, making it ideal for advanced communication systems. Additionally, its potential to be upgraded to a higher-performance version makes it a suitable choice for future communication systems. There are a number of successful case studies demonstrating the successful application of the chip model, however it is important to take into account a number of precautions when using it.
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2,936 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $65.2637 | $65.2637 |
| 10+ | $64.5619 | $645.6192 |
| 100+ | $61.0531 | $6,105.3120 |
| 1000+ | $57.5443 | $28,772.1600 |
| 10000+ | $52.6320 | $52,632.0000 |
| The price is for reference only, please refer to the actual quotation! | ||