AMD Xilinx
XC2S600E-6FG676C
XC2S600E-6FG676C ECAD Model
XC2S600E-6FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 210000 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 210000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 600000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S600E-6FG676C Datasheet Download
XC2S600E-6FG676C Overview
The XC2S600E-6FG676C chip model is a powerful and advanced product designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is designed to be compatible with HDL language, making it easier for developers to create applications that require complex logic and high-speed operations.
The XC2S600E-6FG676C is a highly versatile chip model that is suitable for a variety of applications. It is capable of handling large amounts of data quickly, making it ideal for applications such as real-time video processing, audio processing, and image processing. It is also suitable for use in embedded systems, allowing for the development of more complex systems and applications.
The XC2S600E-6FG676C is designed to be future-proof, allowing it to be upgraded as new technologies become available. This means that the chip model can be used in a variety of applications, from basic embedded systems to more advanced communication systems. It is also designed to be compatible with new technologies, allowing it to be used in applications that require the support of emerging technologies.
The XC2S600E-6FG676C is a powerful and versatile chip model that can be used in a variety of applications. It is designed to be compatible with HDL language and can be used to create complex logic and high-speed operations. It is also designed to be future-proof, allowing it to be upgraded as new technologies become available. This makes it suitable for a variety of applications, from basic embedded systems to more advanced communication systems.
You May Also Be Interested In
1,589 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $65.2637 | $65.2637 |
| 10+ | $64.5619 | $645.6192 |
| 100+ | $61.0531 | $6,105.3120 |
| 1000+ | $57.5443 | $28,772.1600 |
| 10000+ | $52.6320 | $52,632.0000 |
| The price is for reference only, please refer to the actual quotation! | ||