AMD Xilinx
XC2S600E-6FG456C
XC2S600E-6FG456C ECAD Model
XC2S600E-6FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 514 | |
| Number of Outputs | 514 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 210000 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 210000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 600000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S600E-6FG456C Datasheet Download
XC2S600E-6FG456C Overview
The chip model XC2S600E-6FG456C is a multi-functional, high-performance chip that is used in a variety of industries. It has been widely adopted by many companies due to its low power consumption and high performance. This chip model is capable of supporting a variety of tasks, such as digital signal processing, analog-to-digital conversion, and image processing.
In the future, the demand for XC2S600E-6FG456C is expected to grow, as more and more industries are adopting the chip model. This chip model can be used in a variety of applications, such as automotive, medical, and industrial applications. Moreover, this chip model can be used in networks, allowing for the efficient transmission of data. This chip model is also capable of supporting new technologies, such as 5G, which will be essential for the development of the Internet of Things (IoT).
As the technology continues to progress, the chip model XC2S600E-6FG456C is expected to be used in more and more intelligent scenarios. This chip model is capable of supporting the development of fully intelligent systems, such as autonomous vehicles and intelligent homes. The chip model can be used to process data from sensors, allowing for the development of more sophisticated systems. In addition, the chip model can be used to control robotic arms and other robotic devices, allowing for the development of more efficient and reliable robots.
Overall, the chip model XC2S600E-6FG456C is a powerful and versatile chip that is expected to be used in a variety of industries in the future. This chip model is capable of supporting the development of new technologies, such as 5G, and can be used in the development of fully intelligent systems. As the technology continues to progress, this chip model is expected to be used in more and more intelligent scenarios, allowing for the development of more efficient and reliable systems.
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4,698 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $89.2800 | $89.2800 |
| 10+ | $88.3200 | $883.2000 |
| 100+ | $83.5200 | $8,352.0000 |
| 1000+ | $78.7200 | $39,360.0000 |
| 10000+ | $72.0000 | $72,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||