AMD Xilinx
XC2S50E-7PQ208C
XC2S50E-7PQ208C ECAD Model
XC2S50E-7PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 182 | |
| Number of Outputs | 182 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 23000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 23000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 50000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S50E-7PQ208C Datasheet Download
XC2S50E-7PQ208C Overview
The XC2S50E-7PQ208C chip model is a powerful and versatile model that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The chip model XC2S50E-7PQ208C is designed to meet the needs of the current market. It is capable of handling complex tasks and is ideal for use in a variety of industries. It is also capable of supporting new technologies and is well-suited for advanced communication systems.
The original design intention of the chip model XC2S50E-7PQ208C was to create a powerful and versatile model that could handle complex tasks. It is designed to meet the needs of the current market and is capable of supporting new technologies. It is well-suited for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The chip model XC2S50E-7PQ208C is designed to be future-proof and is capable of being upgraded as needed. It is designed to be flexible and versatile, allowing it to be used in a variety of industries and applications. The chip model is also capable of supporting new technologies and can be used in advanced communication systems.
The industry trends of the chip model XC2S50E-7PQ208C and the future development of related industries depend on what specific technologies are needed. The chip model is designed to be flexible and versatile, allowing it to be used in a variety of industries and applications. It is also capable of supporting new technologies and can be used in advanced communication systems.
In conclusion, the chip model XC2S50E-7PQ208C is a powerful and versatile model that is suitable for a variety of applications. It is designed to meet the needs of the current market and is capable of supporting new technologies. It is well-suited for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also capable of being upgraded as needed and is designed to be future-proof. The industry trends of the chip model and the future development of related industries depend on what specific technologies are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||