
AMD Xilinx
XC2S50E-7FG456C
XC2S50E-7FG456C ECAD Model
XC2S50E-7FG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Equivalent Gates | 23000 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL EXTENDED | |
Package Shape | SQUARE | |
Organization | 384 CLBS, 23000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 50000 | |
Clock Frequency-Max | 400 MHz | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 456 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC2S50E-7FG456C Datasheet Download
XC2S50E-7FG456C Overview
The chip model XC2S50E-7FG456C has become a buzzword in the technology industry. It is a high-performance, low-cost, and low-power solution for many applications, such as embedded systems, communication networks, and intelligent robots. It is designed to provide a comprehensive, cost-effective and reliable solution for a wide range of applications.
The industry trends of the chip model XC2S50E-7FG456C are rapidly changing, as new technologies are being developed and applied to the chip. With the development of the Internet of Things (IoT) and artificial intelligence (AI), the chip model XC2S50E-7FG456C is expected to be used in more and more networks and intelligent scenarios. In the era of fully intelligent systems, the chip model XC2S50E-7FG456C could be applied to the development and popularization of future intelligent robots, as it has the capability to process large amounts of data and provide intelligent solutions.
In order to use the chip model XC2S50E-7FG456C effectively, technical talents are required. These talents should have a deep understanding of the technology, as well as the ability to develop and modify the chip model to suit specific applications. They should also possess the knowledge and skills to integrate the chip model into existing networks and scenarios.
In conclusion, the chip model XC2S50E-7FG456C is a promising technology for the future development of networks and intelligent scenarios. It can be used in the era of fully intelligent systems, and its potential applications in the development and popularization of future intelligent robots is immense. Technical talents are needed to use the chip model effectively, and they should possess the knowledge and skills to develop and modify the chip model to suit specific applications.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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