XC2S50E-7FG456C
XC2S50E-7FG456C
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rohs

AMD Xilinx

XC2S50E-7FG456C


XC2S50E-7FG456C
F20-XC2S50E-7FG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

XC2S50E-7FG456C ECAD Model


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XC2S50E-7FG456C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Equivalent Gates 23000
Number of CLBs 384
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Organization 384 CLBS, 23000 GATES
Additional Feature MAXIMUM USABLE GATES = 50000
Clock Frequency-Max 400 MHz
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 456
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC2S50E-7FG456C Datasheet Download


XC2S50E-7FG456C Overview



The chip model XC2S50E-7FG456C has become a buzzword in the technology industry. It is a high-performance, low-cost, and low-power solution for many applications, such as embedded systems, communication networks, and intelligent robots. It is designed to provide a comprehensive, cost-effective and reliable solution for a wide range of applications.


The industry trends of the chip model XC2S50E-7FG456C are rapidly changing, as new technologies are being developed and applied to the chip. With the development of the Internet of Things (IoT) and artificial intelligence (AI), the chip model XC2S50E-7FG456C is expected to be used in more and more networks and intelligent scenarios. In the era of fully intelligent systems, the chip model XC2S50E-7FG456C could be applied to the development and popularization of future intelligent robots, as it has the capability to process large amounts of data and provide intelligent solutions.


In order to use the chip model XC2S50E-7FG456C effectively, technical talents are required. These talents should have a deep understanding of the technology, as well as the ability to develop and modify the chip model to suit specific applications. They should also possess the knowledge and skills to integrate the chip model into existing networks and scenarios.


In conclusion, the chip model XC2S50E-7FG456C is a promising technology for the future development of networks and intelligent scenarios. It can be used in the era of fully intelligent systems, and its potential applications in the development and popularization of future intelligent robots is immense. Technical talents are needed to use the chip model effectively, and they should possess the knowledge and skills to develop and modify the chip model to suit specific applications.



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