AMD Xilinx
XC2S50E-6FG456C
XC2S50E-6FG456C ECAD Model
XC2S50E-6FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 23000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Organization | 384 CLBS, 23000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 50000 | |
| Clock Frequency-Max | 357 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2S50E-6FG456C Datasheet Download
XC2S50E-6FG456C Overview
The chip model XC2S50E-6FG456C is one of the most advanced communication systems available on the market. It features an on-chip array of programmable logic blocks, which can be used to create custom logic functions and to control the logic functions of other chips in the system. This makes it suitable for a wide range of applications, from low-power embedded systems to high-speed communication systems.
In terms of industry trends, the XC2S50E-6FG456C is a reliable and cost-effective solution that can be used in many applications. It is capable of handling high data rates and has the potential to be used in advanced communication systems. The chip model is also capable of being upgraded in the future, making it a versatile and future-proof solution.
In terms of applying the chip model to the development and popularization of future intelligent robots, the XC2S50E-6FG456C has the potential to be used in a variety of applications. It can be used to control the logic functions of other chips in the system, which can be used to control the movements and actions of robots. In addition, it can be used to provide the necessary data processing power for the robots, allowing them to make intelligent decisions and act accordingly.
In order to effectively use the XC2S50E-6FG456C, technical talents are needed. This includes knowledge on how to program the chip, how to configure the logic blocks, and how to integrate the chip into a system. Additionally, knowledge on the design of intelligent robots is also necessary in order to make the most of this chip model.
In conclusion, the XC2S50E-6FG456C is a reliable and cost-effective chip model that can be used in a variety of applications, from low-power embedded systems to high-speed communication systems. It has the potential to be used in advanced communication systems and can be upgraded in the future. Additionally, it has the potential to be used in the development and popularization of future intelligent robots and requires technical talents to use it effectively.
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5,390 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $46.4256 | $46.4256 |
| 10+ | $45.9264 | $459.2640 |
| 100+ | $43.4304 | $4,343.0400 |
| 1000+ | $40.9344 | $20,467.2000 |
| 10000+ | $37.4400 | $37,440.0000 |
| The price is for reference only, please refer to the actual quotation! | ||