XC2S400E-7FGG676C
XC2S400E-7FGG676C
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rohs

AMD Xilinx

XC2S400E-7FGG676C


XC2S400E-7FGG676C
F20-XC2S400E-7FGG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-676
LEAD FREE, FBGA-676

XC2S400E-7FGG676C ECAD Model


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XC2S400E-7FGG676C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 410
Number of Outputs 410
Number of Logic Cells 10800
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-676
Pin Count 676
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2S400E-7FGG676C Datasheet Download


XC2S400E-7FGG676C Overview



The chip model XC2S400E-7FGG676C is a new product in the chip industry, and its emergence brings about a new trend in the industry. As a highly integrated and low-power chip, XC2S400E-7FGG676C has a wide range of applications in various fields. It is widely used in industrial control, medical, automotive, communication, and consumer electronics.


The chip model XC2S400E-7FGG676C has a number of advantages. It is highly integrated, which makes it suitable for a variety of applications. It also has a low power consumption and high performance, making it ideal for applications where power consumption is a major concern. In addition, it is compatible with a variety of operating systems, making it flexible and easy to use.


The chip model XC2S400E-7FGG676C is expected to have a great demand in the future. With the rapid development of technology, the demand for more powerful chips is increasing. The chip model XC2S400E-7FGG676C is expected to meet this demand, as it has a high performance and low power consumption. It is also expected to be used in a variety of applications, such as industrial control, medical, automotive, communication, and consumer electronics.


The chip model XC2S400E-7FGG676C can also be used in networks and intelligent scenarios. It is capable of supporting a variety of protocols, such as Ethernet, Wi-Fi, and Bluetooth, making it suitable for applications in networks. In addition, it is capable of supporting artificial intelligence algorithms, making it ideal for intelligent scenarios. In the future, it is expected to be used in the era of fully intelligent systems, where it will be used to power robots, autonomous vehicles, and other intelligent systems.


In conclusion, the chip model XC2S400E-7FGG676C is a highly integrated and low-power chip that is expected to have a great demand in the future. It is capable of supporting a variety of protocols and artificial intelligence algorithms, making it suitable for a variety of applications in networks and intelligent scenarios. It is expected to be used in the era of fully intelligent systems, where it will be used to power robots, autonomous vehicles, and other intelligent systems.



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