
AMD Xilinx
XC2S400E-7FGG676C
XC2S400E-7FGG676C ECAD Model
XC2S400E-7FGG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 410 | |
Number of Outputs | 410 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL EXTENDED | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2S400E-7FGG676C Datasheet Download
XC2S400E-7FGG676C Overview
The chip model XC2S400E-7FGG676C is a new product in the chip industry, and its emergence brings about a new trend in the industry. As a highly integrated and low-power chip, XC2S400E-7FGG676C has a wide range of applications in various fields. It is widely used in industrial control, medical, automotive, communication, and consumer electronics.
The chip model XC2S400E-7FGG676C has a number of advantages. It is highly integrated, which makes it suitable for a variety of applications. It also has a low power consumption and high performance, making it ideal for applications where power consumption is a major concern. In addition, it is compatible with a variety of operating systems, making it flexible and easy to use.
The chip model XC2S400E-7FGG676C is expected to have a great demand in the future. With the rapid development of technology, the demand for more powerful chips is increasing. The chip model XC2S400E-7FGG676C is expected to meet this demand, as it has a high performance and low power consumption. It is also expected to be used in a variety of applications, such as industrial control, medical, automotive, communication, and consumer electronics.
The chip model XC2S400E-7FGG676C can also be used in networks and intelligent scenarios. It is capable of supporting a variety of protocols, such as Ethernet, Wi-Fi, and Bluetooth, making it suitable for applications in networks. In addition, it is capable of supporting artificial intelligence algorithms, making it ideal for intelligent scenarios. In the future, it is expected to be used in the era of fully intelligent systems, where it will be used to power robots, autonomous vehicles, and other intelligent systems.
In conclusion, the chip model XC2S400E-7FGG676C is a highly integrated and low-power chip that is expected to have a great demand in the future. It is capable of supporting a variety of protocols and artificial intelligence algorithms, making it suitable for a variety of applications in networks and intelligent scenarios. It is expected to be used in the era of fully intelligent systems, where it will be used to power robots, autonomous vehicles, and other intelligent systems.
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QTY | Unit Price | Ext Price |
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