AMD Xilinx
XC2S400E-7FGG456C
XC2S400E-7FGG456C ECAD Model
XC2S400E-7FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S400E-7FGG456C Datasheet Download
XC2S400E-7FGG456C Overview
The XC2S400E-7FGG456C chip model is a high-performance digital signal processor, embedded processor, and image processor. It is designed to be used with a high-level hardware description language (HDL), and is suitable for a range of applications. It has been designed with the intention of providing improved performance and scalability, with the potential for future upgrades.
The XC2S400E-7FGG456C chip model is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. Its high-level HDL capabilities make it an ideal choice for advanced communication systems. It can also be used in the development and popularization of future intelligent robots, as it is capable of handling complex tasks with ease.
In order to use the XC2S400E-7FGG456C chip model effectively, it is important to have a deep understanding of the HDL language. Knowledge of programming languages such as C and C++ is also beneficial, as these can be used to develop applications for the chip. Additionally, knowledge of the architecture of the chip, as well as the hardware and software associated with it, is essential.
In conclusion, the XC2S400E-7FGG456C chip model is a powerful and versatile processor, which can be used in a range of applications, including high-performance digital signal processing, embedded processing, image processing, and the development and popularization of future intelligent robots. In order to use the chip effectively, it is important to have a deep understanding of the HDL language, as well as the hardware and software associated with it.
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