
AMD Xilinx
XC2S400E-7FG676C
XC2S400E-7FG676C ECAD Model
XC2S400E-7FG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 410 | |
Number of Outputs | 410 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL EXTENDED | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC2S400E-7FG676C Datasheet Download
XC2S400E-7FG676C Overview
The chip model XC2S400E-7FG676C is a high-performance and low-power field programmable gate array (FPGA) chip produced by Xilinx. It is the latest device in the Spartan-6 family of FPGAs, and it is designed to meet the requirements of high-speed and low-power applications. This chip model is equipped with powerful logic resources, high-speed transceivers, and a wide range of peripherals, making it suitable for a variety of applications.
The industry trend of the chip model XC2S400E-7FG676C and the future development of related industries can be seen in the increasing demand for FPGA chips in the market. The FPGA chip market is expected to grow significantly in the coming years, driven by the increasing adoption of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). As such, the chip model XC2S400E-7FG676C is expected to be in high demand in the future as it is capable of meeting the requirements of these advanced technologies.
The chip model XC2S400E-7FG676C can be applied to the development and popularization of future intelligent robots. It is capable of providing a high-performance and low-power solution for robotic applications. It can be used to design and implement complex algorithms, such as those related to navigation, motion control, and image processing. In addition, the chip model XC2S400E-7FG676C can be used to control and monitor the various components of a robot, such as motors, sensors, and actuators.
The technical talents needed to use the chip model XC2S400E-7FG676C effectively include those who have a good understanding of FPGA design and development, as well as the associated programming languages. Knowledge of computer architecture and digital signal processing is also necessary. In addition, a good understanding of the various components of a robot, such as motors, sensors, and actuators, is essential for effective utilization of the chip model XC2S400E-7FG676C.
In conclusion, the chip model XC2S400E-7FG676C is an advanced FPGA chip that is expected to be in high demand in the future due to its high-performance and low-power capabilities. It is suitable for the development and popularization of future intelligent robots, and those with the necessary technical skills and knowledge will be able to use it effectively.
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