XC2S400E-7FG676C
XC2S400E-7FG676C
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rohs

AMD Xilinx

XC2S400E-7FG676C


XC2S400E-7FG676C
F20-XC2S400E-7FG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-676
FBGA-676

XC2S400E-7FG676C ECAD Model


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XC2S400E-7FG676C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 410
Number of Outputs 410
Number of Logic Cells 10800
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-676
Pin Count 676
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XC2S400E-7FG676C Datasheet Download


XC2S400E-7FG676C Overview



The chip model XC2S400E-7FG676C is a high-performance and low-power field programmable gate array (FPGA) chip produced by Xilinx. It is the latest device in the Spartan-6 family of FPGAs, and it is designed to meet the requirements of high-speed and low-power applications. This chip model is equipped with powerful logic resources, high-speed transceivers, and a wide range of peripherals, making it suitable for a variety of applications.


The industry trend of the chip model XC2S400E-7FG676C and the future development of related industries can be seen in the increasing demand for FPGA chips in the market. The FPGA chip market is expected to grow significantly in the coming years, driven by the increasing adoption of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). As such, the chip model XC2S400E-7FG676C is expected to be in high demand in the future as it is capable of meeting the requirements of these advanced technologies.


The chip model XC2S400E-7FG676C can be applied to the development and popularization of future intelligent robots. It is capable of providing a high-performance and low-power solution for robotic applications. It can be used to design and implement complex algorithms, such as those related to navigation, motion control, and image processing. In addition, the chip model XC2S400E-7FG676C can be used to control and monitor the various components of a robot, such as motors, sensors, and actuators.


The technical talents needed to use the chip model XC2S400E-7FG676C effectively include those who have a good understanding of FPGA design and development, as well as the associated programming languages. Knowledge of computer architecture and digital signal processing is also necessary. In addition, a good understanding of the various components of a robot, such as motors, sensors, and actuators, is essential for effective utilization of the chip model XC2S400E-7FG676C.


In conclusion, the chip model XC2S400E-7FG676C is an advanced FPGA chip that is expected to be in high demand in the future due to its high-performance and low-power capabilities. It is suitable for the development and popularization of future intelligent robots, and those with the necessary technical skills and knowledge will be able to use it effectively.



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