
AMD Xilinx
XC2S400E-7FG456C
XC2S400E-7FG456C ECAD Model
XC2S400E-7FG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 410 | |
Number of Outputs | 410 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL EXTENDED | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2S400E-7FG456C Datasheet Download
XC2S400E-7FG456C Overview
The XC2S400E-7FG456C chip model is a very versatile and powerful product that has been designed with the intention of providing high-performance, low-power solutions for a variety of applications. It is a Field Programmable Gate Array (FPGA) with a large number of logic elements and memory blocks, making it suitable for a wide range of applications. It is also capable of being upgraded to provide more advanced features and capabilities.
The XC2S400E-7FG456C chip model can be applied to a variety of advanced communication systems, including wireless, optical, and satellite networks. It can also be used in intelligent scenarios such as natural language processing, robotics, and artificial intelligence. With its high-performance capabilities and low-power consumption, the XC2S400E-7FG456C chip model can be used to develop and popularize future intelligent robots, as well as other intelligent systems.
In order to use the XC2S400E-7FG456C chip model effectively, a certain level of technical knowledge and expertise is required. This includes an understanding of the chip's architecture and capabilities, as well as the ability to program the chip and configure it for the desired application. Additionally, an understanding of the different communication protocols used in networks and robotics is necessary, as well as an understanding of the principles of artificial intelligence.
The XC2S400E-7FG456C chip model is a versatile and powerful product that can be used for a variety of applications. It is capable of being upgraded to provide more advanced features and capabilities, and can be applied to a variety of advanced communication systems. With its high-performance capabilities and low-power consumption, the XC2S400E-7FG456C chip model can be used to develop and popularize future intelligent robots, as well as other intelligent systems. In order to use the XC2S400E-7FG456C chip model effectively, a certain level of technical knowledge and expertise is required.
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3,159 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $106.0200 | $106.0200 |
10+ | $104.8800 | $1,048.8000 |
100+ | $99.1800 | $9,918.0000 |
1000+ | $93.4800 | $46,740.0000 |
10000+ | $85.5000 | $85,500.0000 |
The price is for reference only, please refer to the actual quotation! |