
AMD Xilinx
XC2S400E-6FGG676C
XC2S400E-6FGG676C ECAD Model
XC2S400E-6FGG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 410 | |
Number of Outputs | 410 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 145000 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 145000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 400000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2S400E-6FGG676C Datasheet Download
XC2S400E-6FGG676C Overview
The chip model XC2S400E-6FGG676C is a powerful and versatile microcontroller developed by Xilinx, Inc. It is designed to provide high-performance computing capabilities for embedded systems. The XC2S400E-6FGG676C is a low-power, low-cost, and low-latency device, making it ideal for applications in the industrial, automotive, medical, and consumer markets.
The XC2S400E-6FGG676C is a field-programmable gate array (FPGA) and is based on the Xilinx Spartan-6 FPGA family. It is a highly integrated device, featuring a wide range of peripherals, such as a USB 2.0 controller, Ethernet MAC, CAN controller, and a high-speed ADC. Additionally, the XC2S400E-6FGG676C supports a variety of memory types, including DDR2 and DDR3 SDRAM, QDRII SRAM, and flash memory.
The primary advantage of the XC2S400E-6FGG676C is its high performance and low cost. With its low-power architecture, the XC2S400E-6FGG676C can provide high-performance computing capabilities in a cost-effective manner. Additionally, the XC2S400E-6FGG676C’s advanced features, such as its high-speed ADC and Ethernet MAC, make it ideal for applications requiring high-speed data processing and communication.
The XC2S400E-6FGG676C is expected to be in high demand in the future. This is due to its low-power, low-cost, and low-latency capabilities, which make it suitable for a wide range of applications. Additionally, the XC2S400E-6FGG676C’s advanced features make it suitable for applications requiring high-speed data processing and communication.
When designing a system with the XC2S400E-6FGG676C, it is important to consider the specific requirements of the application. This includes the power requirements, memory requirements, and the required peripherals. Additionally, it is important to consider the environmental conditions in which the system will be operating, as this may require the use of additional components or technologies.
In conclusion, the XC2S400E-6FGG676C is a powerful and versatile microcontroller developed by Xilinx, Inc. It is designed to provide high-performance computing capabilities in a cost-effective manner. The XC2S400E-6FGG676C is expected to be in high demand in the future due to its low-power, low-cost, and low-latency capabilities. When designing a system with the XC2S400E-6FGG676C, it is important to consider the specific requirements of the application, as well as the environmental conditions in which the system will be operating.
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