AMD Xilinx
XC2S400E-6FGG456I
XC2S400E-6FGG456I ECAD Model
XC2S400E-6FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S400E-6FGG456I Datasheet Download
XC2S400E-6FGG456I Overview
The chip model XC2S400E-6FGG456I is a high-performance, versatile digital signal processor (DSP) designed for embedded processing, image processing, and other applications. It is capable of supporting high-level hardware description language (HDL) programming, making it an ideal solution for a wide range of applications.
The XC2S400E-6FGG456I is designed to meet the ever-increasing demand for high-performance digital signal processing. It is equipped with advanced features such as a high-speed processor core, a large memory capacity, and a wide range of peripherals. The chip also supports a variety of communication interfaces, allowing it to be used in a variety of applications.
The industry trends of the XC2S400E-6FGG456I and the future development of related industries will depend on the specific technologies that are needed. For example, new technologies such as 5G and AI may be necessary to support the application environment.
The original design intention of the XC2S400E-6FGG456I was to provide a highly efficient and reliable platform for embedded processing, image processing, and other applications. The chip is capable of supporting advanced communication systems, making it a great choice for those looking for a powerful and reliable processor.
The XC2S400E-6FGG456I is designed to be easily upgradable in the future, allowing developers to take advantage of new technologies and features as they become available. It is also capable of supporting the latest communication protocols, making it a great choice for those looking for a powerful and reliable processor.
In conclusion, the XC2S400E-6FGG456I is a high-performance, versatile digital signal processor designed for embedded processing, image processing, and other applications. It is capable of supporting high-level hardware description language (HDL) programming and is designed to be easily upgradable in the future. The chip is also capable of supporting advanced communication systems, making it a great choice for those looking for a powerful and reliable processor.
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