AMD Xilinx
XC2S400E-6FG676I
XC2S400E-6FG676I ECAD Model
XC2S400E-6FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S400E-6FG676I Datasheet Download
XC2S400E-6FG676I Overview
The chip model XC2S400E-6FG676I is a high-performance, low-power FPGA chip developed by Xilinx. It is designed to meet the needs of a variety of applications, such as data processing, communications, and signal processing. It is also suitable for applications that require high-speed data processing and signal processing. With its high-performance, low-power consumption, and low cost, it is widely used in a variety of industries.
As technology advances, the chip model XC2S400E-6FG676I is constantly being upgraded to meet the needs of the industry. The chip model is being used in more and more applications, such as intelligent robots, facial recognition, and autonomous driving. With the development of artificial intelligence, the chip model is being used in more and more advanced technologies, such as deep learning and natural language processing.
In order to use the chip model XC2S400E-6FG676I effectively, technical talents are required. The chip model requires a certain level of expertise in order to be used properly. For example, engineers need to be familiar with the programming language and the architecture of the chip model in order to effectively use it. In addition, engineers need to understand the design of the chip model in order to make sure that it is compatible with the application.
The chip model XC2S400E-6FG676I has the potential to be used in the development and popularization of future intelligent robots. The chip model is powerful enough to handle the processing power that is required for the development of robots. In addition, the chip model is low-cost and low-power, making it an ideal choice for the development of robots.
In conclusion, the chip model XC2S400E-6FG676I is a powerful and versatile chip model that can be used in a variety of applications. It is constantly being upgraded to meet the needs of the industry, and is being used in more and more advanced technologies. In order to use the chip model effectively, technical talents are required. The chip model also has the potential to be used in the development and popularization of future intelligent robots.
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