AMD Xilinx
XC2S400E-6FG676C
XC2S400E-6FG676C ECAD Model
XC2S400E-6FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 145000 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 145000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 400000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S400E-6FG676C Datasheet Download
XC2S400E-6FG676C Overview
The Xilinx XC2S400E-6FG676C is a powerful FPGA chip model that is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is a Field Programmable Gate Array (FPGA) chip, meaning it can be programmed to perform a variety of tasks. It is based on a Xilinx Spartan-6 FPGA architecture, and it requires the use of the HDL language for programming.
The Xilinx XC2S400E-6FG676C offers a number of advantages over other FPGA models. It is a low-cost and low-power chip model, making it ideal for applications that require minimal energy consumption. It also features a high-speed internal clock, allowing for faster data processing. Additionally, the Xilinx XC2S400E-6FG676C is highly customizable, allowing users to tailor the chip to their specific needs.
Due to its low cost and high performance, the Xilinx XC2S400E-6FG676C is expected to be in high demand in the future. It is likely to be used in a wide range of applications, including embedded systems, medical devices, and robotics. It is also expected to be used in the development and popularization of future intelligent robots.
To use the Xilinx XC2S400E-6FG676C effectively, technical talents with a strong knowledge of HDL programming are needed. Those with experience in digital signal processing and embedded systems programming are particularly well-suited to work with the chip model. Additionally, those with experience in robotics and artificial intelligence will be able to leverage the chip model’s capabilities to create sophisticated autonomous systems.
In conclusion, the Xilinx XC2S400E-6FG676C is a powerful chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and more. Its low cost and high performance make it an ideal choice for a variety of applications. In the future, it is likely to be in high demand, and technical talents with knowledge of HDL programming and related technologies will be needed to use the chip model effectively.
You May Also Be Interested In
1,887 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||